SemtechNASDAQ: SMTC: Produces high-performance analog and mixed-signal semiconductor products
3+ YOEBachelors in engineering or related, 3+ years semiconductor deposition/etch experience, hands-on PECVD and ICP-RIE/RIE experience, data analysis and SPC skills, failure analysis and root-cause problem solving.
PECVD, ICP-RIE, RIE, SEM, FIB, SIMS, SPC, DOE, 8D, Six Sigma
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
8+ YOEBachelor's in Electrical/Electronic Engineering, 8+ years semiconductor experience (analog/mixed-signal CMOS), reliability and package qualification, failure analysis, statistical data analysis, project leadership, and customer support.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Design and implement reliability tests for home hardware, quantify reliability risk, support failure analysis, partner across engineering teams, and communicate findings to leadership.
Hermeus: Develops high-speed and hypersonic aircraft for defense and transportation.
3+ YOEBachelor's in engineering,3+ years precision component manufacturing,experience with CNC/welding/additive manufacturing,GD&T and process development,hands-on lab/fixture design and failure analysis.
7+ YOE7+ years electrical/hardware engineering experience, BS in EE or equivalent, PCB schematic/layout and failure analysis experience, familiarity with Cadence Allegro and OrCAD Capture, EM lab instrumentation, and strong collaboration skills.
Anduril Industries: Defense technology building autonomous military hardware and software.
5+ YOE5+ years reliability/design/test engineering experience; BS in Mechanical/Aerospace/Systems Engineering; experience with safety-critical defense or aerospace systems, MIL standards, FMEA/FMECA/FTA, predictive modeling, Weibull analysis, qualification testing, and failure investigation; eligible for U.S. Secret clearance.
Leonardo DRSNASDAQ: DRS: Manufactures advanced electronic systems for defense and military applications.
5+ YOEBachelor's in engineering or related field,5+ years semiconductor process development experience,knowledge of device physics,failure analysis,statistical methods,and problem-solving;U.S. citizenship and ability to hold DOD clearance required.
Skyworks SolutionsNASDAQ: SWKS: Designs and manufactures analog and mixed-signal semiconductor solutions.
5+ YOEBachelor's degree in engineering or materials science, 5+ years experience in semiconductor packaging, expertise in failure analysis, material interaction, yield improvement, SPC/FMEA/Six Sigma knowledge, strong communication and problem-solving skills.
Relativity Space: Designing and manufacturing 3D-printed rockets and launch vehicles.
6+ YOE2+ MgmtBachelor's in materials science/engineering or related field,6+ years materials & process engineering experience,2+ years leading technical teams,proficiency in M&P qualification,failure analysis,and experimental design.
Skorpios Technologies: Designs and manufactures silicon photonics for high-speed optical communications
10+ YOEMaster's (or PhD preferred) in engineering/physics, 10+ years industrial semiconductor/MEMS experience, expertise in Fab process technology (CVD, PVD, etch, photolithography, CMP), silicon photonics, failure/defect analysis, FMEAs, and cross-functional leadership.
CVD, PVD, Etch, Cleans, Photo-Lithography, CMP, Design of Experiments (DOE), Statistical Process Control (SPC), FMEAs
ChromoLogic: Develops and commercializes disruptive medical, aerospace, and security technologies.
PhD in a relevant engineering or chemistry field; background in hollow fiber membranes, filtration, separations, or bioprocessing; experimental design, data analysis, failure analysis; lab testing and prototype experience; strong communication.
Rivian and Volkswagen Group Technologies: A joint venture advancing electric vehicle hardware and software through engineering and manufacturing partnerships.
7+ YOE7+ years in NPI, manufacturing operations, supply chain or operations engineering; BS/MS in Engineering; experience with component lifecycle, material risk mitigation, RMA/failure analysis, and cross-functional collaboration; ability to travel internationally.