IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEHigh school diploma plus 1+ year related hands-on experience or AA/AS with no experience; failure analysis tools, procedural discipline, mechanical aptitude, U.S. citizenship, and ability to obtain security clearance required.
Dual Beam FIB, PFIB, SEM, optical imaging systems, sputter coaters, spin coaters, electron microscopy, mechanical polishing, tracking and reporting systems
Rockford Fosgate: Designs and manufactures high-performance audio equipment and sound systems.
1+ YOELead failure investigations and root-cause analysis, perform electronics debugging, support automated test systems, Bachelor’s in electrical or related field, 1+ years engineering experience, oscilloscope/DMM/Excel skills.
Oscilloscope, DMM, Power Supply, CAN analyzer, Thermal Camera, LabVIEW, Python, Microsoft Excel, SQL
Microchip TechnologyNasdaq: MCHP: Manufacturer of microcontrollers, analog, and mixed-signal integrated circuits.
3+ YOEAssociate degree in electronics or related field, 3+ years semiconductor/lab experience, proficiency with microscopes, curve tracers, X-ray machines, strong attention to detail and communication skills.
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
2+ YOEBachelor's in mechanical engineering, materials science, or related field; 2+ years in aerospace investigations with laboratory analysis; expertise in failure analysis, metallurgy, materials engineering, and aerospace processes.
Material Engineering Component Investigation (MatEng CI)
Bachelor's degree in a technical engineering field and experience in reliability, systems, product development, qualification, complex failure analysis, root cause analysis, reliability testing, and cross-functional technical leadership.
Failure Analysis (FA), Root Cause Analysis (RCA), Design for Reliability (DfR), optical emission spectroscopy (OES), VI probes, RF diagnostics, mass spectrometry, interferometry, signal processing, sensor fusion, control systems, machine learning
BS in engineering, reliability/systems experience, failure analysis and root-cause analysis, develop/execute reliability test plans, lead cross-functional technical projects, strong problem-solving and communication skills.
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
PhD or MS with 3-5 years experience; strong physics of failure; chip-package interactions; reliability testing; power semiconductors; data analysis and reporting.
Power BI, Python, Oracle, SQL, JMP, Minitab, MS Office, FMEA, 8D
Texas InstrumentsNASDAQ: TXN: Designs and manufactures semiconductors and integrated circuits.
2+ YOEBachelor's in electrical engineering or related, 2+ years relevant experience, strong analog/digital circuit knowledge, lab equipment and failure analysis experience, statistics and production test knowledge.
Curve tracer, Return loss analyzer, Oscilloscope, Spectrum analyzer, LabVIEW, TestStand, C, C++
8+ YOE8+ years evaluating aerospace materials (composites/plastics), experience with ASTM/ISO test methods, test plan/report authoring, failure analysis, CAD (Catia), and supervisory/mentorship experience.
Catia, Jira, Confluence, FTIR, SEM, Mass Spectrometer, DSC
Eurofins ScientificEuronext Paris: ERF: Global provider of analytical testing and laboratory services.
Bachelor's or master's in materials science and engineering or equivalent experience; hands-on Dual Beam FIB-SEM experience or demonstrated sample-preparation capability; knowledge of SEM/TEM and semiconductor failure analysis.
Aligned Data Centers: Provides scalable data center infrastructure and colocation services.
10+ YOE10+ years mechanical experience (or advanced degree + 6+ years) in hyperscale data center infrastructure; expert knowledge of cooling systems, chiller plants, thermodynamics, strong failure analysis and leadership skills.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
Ralliant CorporationNYSE: RAL: Global provider of precision instruments, sensors, and monitoring solutions.
7+ YOE3+ MgmtRequires U.S. Person status, bachelor's in engineering, 7+ years engineering experience, 3+ years leading technical teams, expertise in mechanical/ordnance design, failure analysis, configuration management, and continuous improvement.
Scottsdale or Chicago or San Francisco or New York City
$84k-$126k/yrHybridFull Time
Early Warning Services: Operates payment and risk solutions for the financial industry.
4+ YOEBachelor's degree or equivalent, 4+ years relevant experience with 2–4 years in BCP/DR and failure analysis; strong communication, analytical, and problem-solving skills; US work eligibility required (no visa sponsorship).
VAST Data: Enterprise AI infrastructure and unified data platform.
7+ YOEBachelor's in engineering, 7+ years quality engineering experience in enterprise hardware/manufacturing/storage, supplier/manufacturing/field quality expertise, experience with failure analysis and RCCA/SCAR, strong analytics, documentation, and reporting skills.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Master’s or PhD in Materials Science and Engineering or related field; strong material properties knowledge; failure analysis experience; excellent problem-solving and communication; able to work independently and in team; willing to work night shift.
RalliantNew York Stock Exchange: RAL: Sells precision instruments and sensors for diverse industrial sectors.
6+ YOEBachelor's in mechanical engineering, 6+ years mechanical product development, DOE and FEA experience, ability to interpret customer specs, GD&T/DFMEA/DFMA knowledge, qualification testing and failure analysis experience; U.S. citizenship required.