TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
8+ YOERequires 8–10+ years in power electronics or instrumentation hardware, switching and linear regulator expertise, SPICE and PCB design tools, debugging skills, and a bachelor's or master's in Electrical Engineering or related field.
SPICE, PCB design tools, power analyzers, high-bandwidth scopes, current probes, electronic loads, ATE test programs
Ralliant CorporationNYSE: RAL: Global provider of precision instruments, sensors, and monitoring solutions.
Design and debug embedded host-processor hardware (Intel/ARM/FPGA), create schematics and PCB designs, perform signal/power integrity and bring-up, support manufacturing, and mentor junior engineers; U.S. person/export authorization required.
RalliantNew York Stock Exchange: RAL: Sells precision instruments and sensors for diverse industrial sectors.
Design and debug embedded host-processor hardware (Intel/ARM/FPGA), develop PCB schematics, support bring-up and manufacturing, strong digital design and signal/power integrity skills, Python and Verilog familiarity preferred.
Biamp: Manufacturer of professional audio and video communication systems.
5+ YOEDesign and implement production tests, develop fixtures, use flying probe and test instrumentation, program test automation, and mentor junior engineers.
Hardware Platform Applications Engineer - Military & Aerospace
Phoenix or Chandler or Hillsboro or Folsom or Santa Clara
$122k-$232k/yrHybridFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEUS citizenship and ability to obtain U.S. government security clearance; BS in Electrical Engineering/Computer Science; 3+ years board-level platform hardware design and bring-up/debug experience; strong lab debug skills and customer engagement experience.
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
7+ YOERequires a master's degree and 7+ years, or bachelor's degree and 8+ years, in technical engineering; 8+ years in networking hardware, GPU systems, and high-speed interface architecture. Security screening required.
SemiAnalysis: An independent research and analysis firm specializing in semiconductors, artificial intelligence, and infrastructure.
2+ YOE2+ years in hardware, silicon engineering, system architecture, or technical analysis preferred; requires hardware expertise, technical writing, research habits, analytical reasoning, and semiconductor lab tool aptitude.
Python, FIB, SEM, ISSCC, IEDM, VLSI, Hot Chips, ISTFA, PAINE, ECTC, OCP
Senior Electrical Engineer – Digital Hardware & FPGA Design
Wilsonville, Oregon, United States
OnsiteFull Time
Teledyne TechnologiesNYSE: TDY: Manufactures sensors, cameras, and electronics for aerospace and defense.
5+ YOE5+ years digital hardware/embedded electronics experience; strong high-speed PCB and FPGA design skills; knowledge of signal/power integrity and debugging; excellent communication and documentation skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOE5+ years hands-on experience leading an electronics or testing lab; ability to perform surface-mount rework; OS and basic networking proficiency; disciplined hardware and inventory management; comfortable lifting 35+ lbs.
Microsoft Office, Linux, oscilloscope, database tools
Santa Clara or Austin or Hillsboro or Durham or Redmond
$184k-$357k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
8+ YOE8+ years relevant experience, degree in EE/CS/CE (or equivalent experience), expertise in SoC/GPU/ASIC architecture, programming in C/C++, Verilog, ARM assembly, Python/Perl, strong communication and security architecture experience.
Lam ResearchNASDAQ: LRCX: Manufacturing equipment used to fabricate advanced semiconductor microchips.
5+ YOEBSME/MSME/PhD in mechanical engineering with 5–10+ years experience, portion of management experience, strong electro‑/opto‑mechanical design, DFx, DFMEA, tolerance, thermal/structural analysis, sensor and firmware integration.
HPNYSE: HPQ: Manufacturer of personal computers, printers, and imaging devices.
2+ YOE2+ years relevant experience recommended; degree in engineering or commensurate experience; skills in debugging, root cause analysis, design of experiments, statistics, JMP, Python; test engineering and hardware validation experience.
HPNYSE: HPQ: Produces personal computers, printers, and related digital imaging products.
2+ YOEDevelop and execute lab test activities, design experiments, debug hardware and printing systems, perform root cause analysis and test automation; typically 2-4 years' experience; engineering degree preferred.
Sandvik: Global engineering group providing industrial tools and mining equipment.
5+ YOEBachelor's in Engineering,5+ years engineering experience in automation/robotics/metrology,strong system-level troubleshooting across hardware/firmware/software/controls,SolidWorks/PDM experience,ability to travel ~10–30%,valid passport preferred.
Agility Robotics: Develops bipedal humanoid robots for industrial warehouse automation.
6+ YOEBS/MS in engineering or equivalent experience, 6+ years deploying robotics or automation systems, Python, networking, hardware/software interfacing, mechatronics, industrial automation, leadership, and customer collaboration.
AutoStoreOslo Stock Exchange: AUTO: Robotic cube storage systems for automated warehouse fulfillment.
3+ YOE3+ years field engineering or system engineering experience; strong hardware/software troubleshooting, data analysis (Power BI/Databricks), root-cause analysis, and regular travel; bachelor's degree in engineering or computer science required.
Datavault AINasdaq: DVLT: AI-driven data management, valuation, and event technology solutions.
3+ YOEBachelors in Computer Science/Computer Engineering,3+ years software development experience,proficiency in C and embedded systems,experience with software/hardware integration and customer support,excellent communication and documentation skills.
C, Android, Linux, WiSA, Express, IoT, SoC, hardware development kits