Power IntegrationsNASDAQ: POWI: Produces high-voltage integrated circuits for efficient power conversion.
15+ YOE15+ years IC design experience with proven global leadership; deep expertise in high-voltage/power IC, mixed-signal integration, semiconductor processes (BCD, HV, GaN preferred); track record delivering silicon on schedule and improving design productivity.
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
15+ YOELead system IC architecture for PoL/SiP; 15+ years in power semiconductors, packaging, and system integration; AI compute and automotive power experience valued.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
10+ YOEBS or MS in Electrical Engineering with 10+ years of IC physical design experience; extensive tool experience (Innovus, VCLP, Formality, LEC, Calibre); Cadence Innovus; TCL scripting; Python.
Teledyne TechnologiesNYSE: TDY: Manufactures sensors, cameras, and electronics for aerospace and defense.
2+ YOE2+ years BiCMOS IC design with tape-out experience, BS/MS/PhD in Electrical Engineering, RF and wideband design skills, proficiency with Cadence tools and Python, strong collaboration and communication.
Keysight TechnologiesNYSE: KEYS: Provides electronic design, test, and simulation software and hardware.
5+ YOEBS/MS/PhD in electrical engineering, 5+ years IC/mm-wave test experience, RF characterization, wafer probe calibration, test automation and C/C#/C++/.NET programming experience.
C#, C++, .NET, C, Microsoft Visual Studio, ADS, network analyzer, signal source, spectrum analyzer
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
Skyworks SolutionsNASDAQ: SWKS: Designs and manufactures analog and mixed-signal semiconductor solutions.
8+ YOE8+ years IC layout experience, proficiency with Cadence Virtuoso, SkillCAD and Calibre, strong semiconductor process knowledge; Bachelors preferred.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in engineering plus 4+ years (or MS+3 or PhD+2) in system/package design or technology engineering; expertise in advanced IC packaging (FCCSP, FCBGA, SiP, RDL, 2.5D/3D), NPI, reliability testing, FMEA/SPC, and cross-functional collaboration.
Quantum Motion: Develops scalable quantum processors using silicon-based technology.
5+ YOEExtensive experience in cryogenic electronics, IC testing, data analysis, and hardware/software debugging; strong programming (Python/C) and circuit understanding; degree in Electrical/Electronic/Computer Engineering.
SMU, VNA, Oscilloscope, Amplifier, Python, C Programming, Schematic reading
SRI International: Independent nonprofit research institute conducting scientific and technology R&D.
3+ YOERequires degree in electrical/computer/physics engineering, 3+ years analog IC design experience (or master's new grad), US citizenship/permanent residency, knowledge of analog circuits, and Cadence/Spectre tool experience.
Texas InstrumentsNASDAQ: TXN: Designs and manufactures semiconductors and integrated circuits.
1+ YOEBachelor's in EE/ECE or related, 1+ years analog or mixed-signal IC design; strong analog fundamentals; experience with Cadence Spectre or HSPICE; familiarity with CMOS/BiCMOS/BCD; scripting (PERL, Python, SKILL).
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOE12+ years IC packaging development/NPI experience; degree in materials/mechanical/electrical/physics or equivalent; deep packaging expertise; familiarity with FA tooling and EDA/FEM tools.
BIOTRONIK: Manufactures cardiovascular and endovascular medical devices for patient therapy.
6+ YOE6+ years analog/mixed-signal IC design experience for low-power implantable or portable medical applications; bachelor\u0002s in electrical engineering or related; strong CMOS, transistor-level and layout skills; Cadence tool experience.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
12+ YOEBS/MS/PhD in Materials Science, Mechanical, Electrical, Physics or related; 12+ years IC packaging/NPI experience; knowledge of flip-chip, 2.5D/3D, wire bonding; FA and prototyping experience.
Consolidated Asset Management Services: Provides operations, maintenance, and asset management for energy infrastructure.
2+ YOEInstrumentation, controls and electrical maintenance technician with experience in DCS/PLC, high/low voltage, and Maximo; with at least a HS diploma and specialized Instrument Technician training.
DCS, GE Mark VI, EX2100e, Siemens T3000, Allen-Bradley PLCs, Maximo, High voltage switchgear, Transformers