Hark: Artificial intelligence hardware developing multimodal AI systems.
3+ YOE3+ years in acoustic integration or audio test engineering for shipped consumer hardware; expertise in transducers, microphone arrays, acoustic testing, and reading schematics.
LogitechNasdaq: LOGI: Designs and manufactures computer peripherals and hardware solutions.
3+ YOE3-5 years in embedded software or system integration; strong C/embedded skills; protocols USB/Bluetooth/WiFi; cross-functional collaboration; BS/MS in EE/CS or related field; strong communication.
Embedded software, System integration, Debugging, USB, Bluetooth, WiFi
SanminaNASDAQ: SANM: Designs and manufactures complex electronics and mechanical systems.
7+ YOEBS in Mechanical or Industrial Engineering; 7+ years in system integration; AutoCAD knowledge; PCB process knowledge a plus; Lean Six Sigma certification/training preferred.
Microchip TechnologyNasdaq: MCHP: Manufacturer of microcontrollers, analog, and mixed-signal integrated circuits.
12+ YOEBachelor's in Electrical Engineering or related, 12+ years semiconductor process integration experience, knowledge of CMOS process integration and device physics, TCAD/PDK familiarity, strong analytical and communication skills.
Figure: Develops autonomous humanoid robots for commercial and residential tasks.
3+ YOE3+ years in automation/robotics integration or deployment, engineering degree, hands-on electro-mechanical skills, stakeholder/customer experience, familiarity with Confluence and Jira, willingness to travel to collection sites.
InnoPhase IoT: Develops ultra-low power wireless semiconductor platforms for IoT devices.
5+ YOEBS/MS in CS or related, 5+ years in integration/release engineering, experience with JIRA/Confluence/Jenkins/Git, Unix/Linux, embedded toolchains, C (Python a plus), and wireless product experience preferred.
JIRA, Confluence, Jenkins, Git, Unix/Linux, C, Python, MS Project, Smartsheet
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
5+ YOEBS in Mechanical Engineering or equivalent,5+ years electro-mechanical design experience,Solidworks and PDM familiarity,stress/FEA knowledge,connector and signal integrity experience,remote collaboration and presentation skills.
Solidworks, PDM, FEA, Microsoft Teams, Webex, Zoom, Cadence Allegro
Bio-TechneNASDAQ: TECH: Provides reagents, instruments, and diagnostic tools for life sciences.
10+ YOE10+ years in complex instruments/systems; Bachelors in engineering; experience with hardware/optical/software integration; V&V; Python/LabVIEW; cross-functional leadership.
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
8+ YOEBS or MS in Electrical Engineering with 8+ years in memory circuit design; experience with TSV or high-speed memory interfaces, timing/parasitic/signal and power integrity, project leadership, and Verilog-based verification.
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
8+ YOEBS/MS in Electrical Engineering with 8+ years in memory circuit or high-speed interface design; experience with TSV and high-speed memory interfaces, timing and signal/power integrity, project leadership, and Verilog-based verification.
8+ YOEM.S. or higher in engineering plus 8+ years in multi-disciplinary environments; experience with spacecraft systems, payload integration, V&V and AI&T workflows; ability to drive product-line engineering and align senior stakeholders.
LumentumNASDAQ: LITE: Manufacturer of optical and photonic components for global networks.
3+ YOEProcess integration engineer for III-V wafer devices; PhD (3+ years) or MS (5+ years) in physics, EE, or materials; hands-on optics; VBA/LabVIEW/C/C++, Matlab; MES/QMS/DOE/统计分析; on-site in San Jose, CA.
Western DigitalNASDAQ: WDC: Design and manufacture data storage devices and systems.
5+ YOEM.S. or Ph.D. in a related field, 5+ years integration/process experience in HDD/semiconductor/manufacturing, strong problem solving, project management, data analysis, and proficiency with Excel, PowerPoint, JMP, and SAS.
Credo SemiconductorNASDAQ: CRDO: Designing high-speed semiconductor connectivity solutions for data infrastructure.
Master’s or higher in Electrical/Communications Engineering or Physics; hands-on with high-speed transceivers; strong problem-solving; good communication; SerDes, signal integrity, and DSP familiarity.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
15+ YOEMS or PhD in engineering, 15+ years in advanced semiconductor packaging and silicon photonics, experience with 2.5D/3D integration, OSAT/vendor management, NPI and yield optimization.
General Dynamics Mission SystemsNYSE: GD: Designs and manufactures defense and mission-critical technology solutions.
8+ YOEBachelor's in Systems Engineering or related STEM, 8+ years' experience (or Master's +6). TS/SCI clearance and U.S. citizenship required. Experience with systems engineering, DSP, MATLAB, Python, MBSE, and hardware integration preferred.
PayPalNASDAQ: PYPL: Global digital payments platform for consumers and merchants.
5+ YOE5+ years relevant experience and a bachelor’s degree (or equivalent); experience implementing integrations, troubleshooting, coding support, onboarding acquisitions, and advocating security best practices.