NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
3+ YOEMS in Electrical or Computer Engineering (or equivalent), 3+ years experience, strong background in advanced submicron process issues, standard cell and custom ROM design, SPICE and DRC/LVS experience, EM/IR and variation simulations, and scripting (Perl, Tcl, Make).
Cadence Design SystemsNASDAQ: CDNS: Develops computational software and hardware for electronic system design.
1+ YOEBS/MS/PhD in Electrical Engineering with 7/5/1+ years respectively; experience with Cadence Innovus/Tempus/QRC/Voltus/Pegasus and Palladium/Protium; Linux and Shell/Perl/TCL scripting; RTL synthesis, floorplanning, timing closure, IR drop, and industry interfaces (PCIe, DDR, LPDDR, SRAM, UCIe).
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
5+ YOEBachelor's in EE/CE/CS,5+ years in power integrity/PDN/circuit/physical/package/EDA workflows,production-quality Python coding,ML/AI applied to engineering workflows,understanding of PDN and IR drop analysis.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
12+ YOE12+ years experience in full physical design cycle (RTL to tape-out). Bachelor’s in Electrical/Electronics Engineering, Tcl/Perl scripting, proficiency with EDA tools, timing closure, EM/IR analysis, and strong communication skills.
8+ YOEBachelor's degree or equivalent; 8+ years in physical design with power delivery and advanced process nodes; experience with power grid integrity (EM/IR), place-and-route, and design-rule-check flows; EM/IR analysis and verification skills.
Exploration Technology Group: Designs and builds hardware for space and defense missions.
5+ YOE5+ years in IR sensor systems, EO payloads, or space imaging; strong Kalman filtering, tracking, data association; CNNs/ML for real-time embedded inference; MATLAB/Python with production C++ experience.
Kalman filters (EKF, UKF), multi-target tracking, data association (JPDA, MHT), MATLAB, Python, C++, CNNs, embedded FPGA and GPU, radiometric modeling, Monte Carlo, hardware-in-the-loop
Etched: Designs specialized AI chips optimized for transformer architectures.
5+ YOEB.S./M.S. in EE,5+ years PI experience on high-current/high-performance designs, proficiency with PI EDA tools, DC IR-drop and AC impedance analysis, VRM and PCB stack-up knowledge.
BrazeNASDAQ: BRZE: Platform for personalized customer engagement and cross-channel messaging.
5+ YOESeveral years owning cloud security in production (including on-call), hands-on AWS and GCP, self-managed Kubernetes, Python and Terraform coding, detection/IR experience, and strong architecture and IAM skills.
Cerebras SystemsNasdaq: CBRS: Manufactures specialized computer chips designed for AI.
10+ YOE10+ years physical design experience; expertise in full-chip physical verification, DRC/LVS resolution with ICV or Calibre, IR/EM analysis, 3D/2.5D packaging and die stacking; scripting with Tcl and Python; familiarity with Synopsys tools.
Kai Cyber: Agentic AI platform for autonomous enterprise cybersecurity operations.
7+ YOE7+ years software engineering (4+ in static/program analysis or compiler infrastructure); deep knowledge of control/data-flow, call graph construction, inter-procedural and taint/reachability analysis; strong Java/Go/C++ skills; IR/bytecode/AST experience; technical ownership.
Java, Go, C++, LLVM, MLIR, SSA, IR, bytecode, ASTs, CI/CD
Senior Staff Applied AI Engineer - Context Retrieval
Mountain View or San Francisco
$229k-$343k/yrHybridFull Time
Databricks: A unified platform for data analytics and artificial intelligence.
10+ YOE10+ years software engineering; deep IR and retrieval systems experience; expertise in LLM-era retrieval and agentic systems; experience building 0→1 retrieval stacks and multi-source data retrieval.
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
7+ YOE10+ years PI experience with bachelor’s (or 7+ with advanced degree); deep power integrity expertise for 2.5D/3D packaging, PDN design, transient/EM/IR analysis, simulation tool proficiency, and cross-functional leadership.
Lightmatter: Develops photonic processors and interconnects for AI data centers
12+ YOEBachelor's in EE/CE,12+ years physical design experience with large ASIC tape-outs,timing/LVS/DRC closure,3nm experience,proficiency in TCL and Python,EM/IR and Cadence tool experience preferred.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Design and develop camera and sensing hardware including visible and IR illumination and sensors; collaborate across teams to research, test, and qualify imaging and optical sensing technologies.
WiproNYSE: WIT: Global technology services and consulting for digital transformation.
3+ YOEBachelor's or Master's in EE/CE, 3+ years physical design/PnR experience, hands-on Synopsys Fusion Compiler, STA and timing closure, low-power/UPF implementation, signoff (DRC/LVS/IR/EM), scripting in Tcl/Perl/Python.
Synopsys Fusion Compiler, Static Timing Analysis (STA), Place & Route, Unified Power Format (UPF), Tcl, Perl, Python, DRC, LVS, IR drop, EM analysis, MMMC
Tech Lead Physical Design Engineer, Power Integrity
San Jose, California, United States
$160k-$200k/yrOnsiteFull Time
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
5+ YOE5+ years IR drop and electromigration (EMIR) power-integrity experience for advanced-node SoCs, bachelor's in EE/CE, proficiency with Voltus/RedHawk-SC/PrimeTime PX, and scripting in Tcl/Python/Perl.
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
10+ YOEBS with 10+ yrs, MS with 8+ yrs, or PhD with 5+ yrs; experience in Triton/Helion/MLIR/XLA/TVM/Inductor/IREE/CUTLASS; kernel DSL/IR design; MLIR; PyTorch backends; kernel autotuning; HPC/NUMA; open-source contributions.