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Director – Package Materials Integration, APTD
Boise, Idaho, United States
OnsiteFull Time
15+ YOE10+ MgmtLead global team; oversee advanced packaging materials roadmap; 15+ years in semiconductor packaging; MS/PhD preferred.
1mo
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Director – Package Materials Integration, APTD
Boise, Idaho, United States
OnsiteFull Time
15+ YOE10+ MgmtMS or PhD in chemistry/chemical engineering/materials science; 15+ years semiconductor experience, 10+ years management; expertise in advanced packaging materials, 2.5D/3D integration, supplier engagement, materials characterization, and process integration.
2mo
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Traveling Construction Materials Testing Technician
Wheat Ridge or Phoenix or Albuquerque or Tucson or Las Vegas or Boise or Fort Collins
$19-$29/hr OnsiteFull Time
1+ YOEHigh school diploma; 1-2 years relevant experience; proficiency with laptop, Word and Excel; valid driver’s license.
Laptop, Microsoft Word, Microsoft Excel
3mo
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Mining Engineer
Boise, Idaho, United States
$100k-$125k/yr OnsiteFull Time
5+ YOEBachelor's in Mining Engineering; 5+ years in aggregate materials; knowledge of mine planning; proficiency with mining software; strong communication and change management; PE preferred or EIT with PE in 5 years.
AutoCAD Civil 3D, Carlson, MineSight, ESRI GIS, MS Office
1mo
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Process Support Engineer III
Boise, Idaho, United States
$108k-$149k/yr OnsiteFull Time
4+ YOEBachelor's in chemistry/physics/materials/electrical engineering; 4–7 years semiconductor fab or equipment experience; strong English communication.
Design of Experiments, Statistical Analysis, Root Cause Analysis
3mo
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Senior Packaging & Material Handling Systems Engineer
Meridian or Madison or Minneapolis or Plover
$86k-$126k/yr OnsiteFull Time
5+ YOEBachelor’s degree in engineering; 5+ years in packaging and material handling; AutoCAD; travel 10–25%; strong client communication.
AutoCAD
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R&D Engineer III - Advanced Memory
Boise, Idaho, United States
OnsiteFull Time
6+ YOE6+ years experience in semiconductor/photomask manufacturing or process development; BS/MS in Engineering, Physics, Chemistry, Materials Science or related; expertise in lithography, metrology, OPC, process troubleshooting, and cross-functional project leadership.
3w
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
1mo
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Technical Support Engineer - Semiconductor Metrology
Boise, Idaho, United States
$35-$59/hr OnsiteFull Time
0+ YOEProvide L1–L3 technical support and field assistance for semiconductor metrology tools, document BKMs, diagnose and resolve issues, present and write technical materials, and travel ~40% (domestic/international). Master's or equivalent experience preferred.
2mo
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Thermal Spray Development Engineer
Boise, Idaho, United States
OnsiteFull Time
PhD/Master/Bachelor in Materials Science or Engineering; experience with thermal spray, ceramics, suspension plasma spray; DOE; coating characterization; semiconductor equipment background preferred.
thermal spray equipment, ceramics, suspension plasma spray, micrograph analysis, DOE
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