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Director – Package Materials Integration, APTD
Boise, Idaho, United States
OnsiteFull Time
15+ YOE10+ MgmtMS or PhD in chemistry/chemical engineering/materials science; 15+ years semiconductor experience, 10+ years management; expertise in advanced packaging materials, 2.5D/3D integration, supplier engagement, materials characterization, and process integration.
2mo
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Staff/ Principal Engineer, OCT MTE Material Engineering
Boise, Idaho, United States
OnsiteFull Time
8+ YOE8+ years in semiconductor manufacturing or materials engineering; global, multi-functional collaboration; travel; Bachelor's or Master's in Science/Engineering.
1mo
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R&D Engineer III - Advanced Memory
Boise, Idaho, United States
OnsiteFull Time
6+ YOE6+ years experience in semiconductor/photomask manufacturing or process development; BS/MS in Engineering, Physics, Chemistry, Materials Science or related; expertise in lithography, metrology, OPC, process troubleshooting, and cross-functional project leadership.
2mo
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Thermal Spray Development Engineer
Boise, Idaho, United States
OnsiteFull Time
PhD/Master/Bachelor in Materials Science or Engineering; experience with thermal spray, ceramics, suspension plasma spray; DOE; coating characterization; semiconductor equipment background preferred.
thermal spray equipment, ceramics, suspension plasma spray, micrograph analysis, DOE
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