6 microelectronics process engineer jobs at 5 companies in Massachusetts
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Sr Process Engineer
Woburn, Massachusetts, United States
OnsiteFull Time
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
7+ YOEBachelor's in engineering, 7+ years in electronics/microelectronics manufacturing or process engineering, hands-on SMT and PCB assembly experience, IPC/soldering knowledge, DOE/SPC proficiency, and experience leading cross-functional projects.
pick and place machines, reflow ovens, AOI/AXI, wave/selective solder, auto bonding equipment, conformal coating, SPC, DOE, PFMEA, 8D, DMAIC, SAP, Oracle, Honeywell Forge
MIT Lincoln Laboratory: Building advanced technology prototypes for national security.
MS in EE/ME/Materials required; experience in semiconductor/MEMS microfabrication, process integration, metrology, DOE, device testing, and programming (MATLAB, Python, LabVIEW); strong lab, problem-solving, and communication skills.
Senior Quality Engineer - Thick Film & Microelectronics Assembly
Canton, Massachusetts, United States
$110k-$160k/yrOnsiteFull Time
Remtec: Manufacturing advanced ceramic packaging and metalized substrates for electronics.
3+ YOEBachelor's in engineering or materials science, 3+ years quality engineering in microelectronics/semiconductor manufacturing, experience with thick film processes, AS9100/ISO9001 familiarity, root cause analysis, SPC/DoE, and APQP/PPAP/DFMEA/PFMEA.
AS9100, ISO 9001, SPC, DoE, APQP, PPAP, DFMEA, PFMEA, MIL Standard
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
3+ YOEBachelor's in STEM, 3+ years microelectronics processing experience (wet/dry etching, plating), U.S. citizenship and active DoD Secret clearance, strong communication and data analysis skills.
Rochester Electronics: Licensed semiconductor manufacturer and distributor for end-of-life components.
3+ YOEBachelor's degree in microelectronics/physics/electrical engineering, ~3 years related experience preferred, knowledge of semiconductor device/process technologies, FA tool experience, strong communication and attention to detail.
Chemical de-processing, Plasma de-processing, Cross sectioning, Junction staining, Optical microscopy, SEM microscopy, EDS, SEM Backscatter, Laser Isolation, FIB (Focused Ion Beam), C-SAM (Scanning Acoustic Microscopy), JEOL IT700HR, EDAX, JEOL 6401FV, Polishers, Reactive Ion Etcher, Jet etcher, X-ray
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
0+ YOEAbility to support microelectronic manufacturing: process improvement, SPC, cycle-time reduction, defect disposition, automation programming; U.S. citizenship and ability to obtain DoD Secret clearance required.
Wire and Ribbon bonding equipment, MIL-PRF-38534, MIL-STD-883, SPC