9 module development engineer jobs at 4 companies in Phoenix, AZ
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Packaging Module Development Engineer
Phoenix or Chandler
$115k-$220k/yr HybridFull Time
1+ YOEPhD or Master's in engineering/physics/materials,1+ year experience in mechanical design/equipment development,strong experimental and prototype background,publication record for PhD candidates.
1w
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Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
3mo
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$115k-$220k/yr OnsiteFull Time
3+ YOEMaster's degree in Mechanical, Materials, Electrical Engineering, Physics/Applied Physics or related; 3+ years experience or PhD; programming (Python, MATLAB); AI/ML; semiconductor packaging experience; onsite presence.
Python, MATLAB, Artificial Intelligence, Machine Learning
1mo
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Module Development Engineer - RF Test
Phoenix or Chandler
$115k-$220k/yr OnsiteFull Time
3+ YOEUS citizenship and ability to obtain TS/SCI clearance; degree in electrical engineering or related STEM with relevant experience; 3+ years RF design/test and IC/ATE experience; proficiency with lab equipment, HFSS/ADS/PowerSI, Cadence Allegro; programming (Python/MATLAB/LabVIEW) preferred.
BERTS, mixed-signal oscilloscopes, spectrum analyzers, signal analyzers, network analyzers, signal generators, VNAs, TDRs, automatic test equipment (ATE), HFSS, ADS, PowerSI, Cadence Allegro, Python, MATLAB, LabVIEW
1mo
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Packaging Module Development Engineer
Chandler or Phoenix
$134k-$255k/yr OnsiteFull Time
3+ YOEPhD in ME/ChE/Materials, 3+ years thermal-mechanical/FEA and experimental characterization experience (DMA/TMA, nano-indentation); strong simulation-to-experiment skills and scripting (Python/TCL/MATLAB); regular onsite presence in Chandler, AZ.
Finite Element Analysis (FEA), Python, TCL, MATLAB, Dynamic Mechanical Analysis (DMA), Thermomechanical Analysis (TMA), nano-indentation
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Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
2mo
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ServiceNow Developer, Configuration & Integrations Consultant
Gilbert or Lake Mary or Mechanicsburg
HybridFull Time
3+ YOEBachelor's degree, U.S. citizen eligible for Public Trust clearance, 3+ years ServiceNow development, experience with ServiceNow modules (ITSM, ITOM, ITAM, CSM, SPM), hybrid residency near a US Delivery Center, up to 10% overnight travel.
ServiceNow, IntegrationHub, Flow Designer, CMDB, Information Technology Service Management (ITSM), Information Technology Operations Management (ITOM), Information Technology Asset Management (ITAM), Customer Service Management (CSM), Strategic Portfolio Management (SPM)
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Sr. Software Engineer II - Front End (Apex Platform)
Scottsdale or Los Angeles
$120k-$135k/yr HybridFull Time
6+ YOE6+ years front-end engineering experience with HTML,CSS,JavaScript,TypeScript, SPAs, module federation and micro front-end architectures; Git and CI/CD experience; leadership and mentoring experience.
Mico Front Ends, Module Federation, HTML, CSS, JavaScript, TypeScript, Single Page Applications, Rect, Git, CI/CD, C#, .NET core, AWS, Terraform, Docker, Kafka, TDD, BDD, Elasticsearch, AWS DynamoDB
1mo
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Senior Technical Lead, New Product Development, SiC & Si Power Discretes/Modules
Scottsdale or San Jose
OnsiteFull Time
10+ YOEMaster's/PhD in EE/Materials/Physics, 10+ years in power semiconductor product development (SiC/Si MOSFET preferred), deep device and packaging expertise, proven cross-functional leadership, escalation and executive communication skills.