118 package designer jobs at 63 companies in San Francisco, CA
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Sr. Package Designer
San Francisco, California, United States
$90k-$138k/yrHybridFull Time
Benefit Cosmetics: Sells high-end makeup products and provides professional eyebrow styling.
6+ YOE6+ years design experience (packaging a plus), strong concepting and print production knowledge, advanced industry-standard software skills, project management proficiency, sustainability experience, and ability to collaborate cross-functionally.
Publicis GroupeEuronext Paris: PUB: Global communications, advertising, and digital transformation holding.
5+ YOE5+ years agency experience preferred; multidisciplinary experience in brand identity, design systems and packaging; mastery of Adobe Suite and Figma; strong communication and production skills.
Publicis GroupeEuronext Paris: PUB: Global advertising and digital transformation agency holding.
5+ YOE5+ years agency experience preferred; multidisciplinary experience in brand identity, design systems and packaging; mastery of Adobe Suite and Figma; strong craft, communication, and organizational skills.
Kendo BrandsEuronext Paris: MC: Incubates and develops global prestige beauty and skincare brands.
5+ YOE5+ years design experience (1+ year packaging), BA in design preferred, Adobe CC proficiency (Illustrator, Photoshop, InDesign), strong communication, organization, and ability to meet tight deadlines.
Mochi Health: Provides telehealth weight management and prescription medication services.
3+ YOE3+ years brand design experience, portfolio required, proficiency with Figma, Photoshop, Illustrator, experience with brand identity systems and visual design across packaging and advertising.
Quince: Sells high-quality apparel and home goods at accessible prices.
4+ YOEBachelor's in graphic design, 4+ years print/direct mail design experience, expert in Adobe Creative Suite and Figma, deep print production knowledge, strong typography, vendor and production management, and data-informed iteration.
Adobe Creative Suite, InDesign, Illustrator, Photoshop, Figma, Google Meets, Zoom
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
8+ YOEBachelor's in engineering or equivalent, 8 years experience in chip package substrate design using Cadence APD or Mentor Expedition, EM/DFM/taping experience, design automation and scripting, B.S./M.S./PhD preferred.
DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOERequires 8+ years of advanced package layout experience, including multi-die 2.5D/3D packages, substrate and interposer routing, package DRC/LVS, and collaboration with physical design, SI/PI, thermo-mechanical, and OSAT teams.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
Lightmatter: Develops photonic processors and interconnects for AI data centers
5+ YOEBachelor’s or master’s degree in electrical engineering or similar, 5+ years relevant experience, 3–5 years IC package layout design, and Allegro X APD proficiency.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
OpenAI: Develops artificial intelligence models and generative AI software services.
5+ YOERequires 5+ years in signal integrity, power integrity, high-speed interconnects, PDN, and package electrical design, plus SI/PI simulation, package layout, and automated optimization experience.
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yrHybridFull Time
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.