Nexperia: Manufactures discrete semiconductors, logic devices, and power MOSFET components.
8+ YOELead packaging strategy; bachelor's in engineering; 8+ years in semiconductors; 7+ years in packaging, DoE, data analysis, and reliability tests; 5+ years in project management; travel up to 5%.
Six Sigma, DoE, Data analysis, Semiconductor packaging, Reliability testing, Package design
Hartford or Indianapolis or Raleigh or Richardson or Tempe or United States
OnsiteFull Time
InfosysNYSE: INFY: Provides IT consulting, software development, and business outsourcing services.
Experience with Oracle CX/Fusion Service Cloud, Service Request and Knowledge Management, Groovy scripting, webservices integration, ERP/ERP package customization, and delivering client-facing implementations; bachelor\u0002s degree or equivalent required.
Oracle CX Cloud, Fusion Service Cloud, Oracle Service Cloud, Digital Customer Service, Oracle Customer Relationship Management, Application and Page Composer, Groovy Scripting, Redwood UX, Visual Builder, Webservices, ETL
OnTrac: Provides last-mile delivery services for e-commerce retailers.
Ability to stand for long periods, lift/push/pull packages averaging 50 lbs and occasionally up to 75 lbs, work in varying warehouse temperatures, be at least 18 years old, and have basic spoken and written English for safety and operations.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
TechnipFMCNYSE: FTI: Supplies technology and equipment for global energy production projects.
Engineering degree or equivalent, project management experience (up to 5 years), professional English, knowledge of on-/offshore and subsea projects, ability to lead teams and manage schedules and budgets.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Grundfos: Manufactures energy-efficient water pumps and advanced water technology solutions.
Interpret engineering drawings and wire, fabricate, install, and test electrical systems on packaged assemblies; HS diploma/GED required; 3-5 years electrical/manufacturing experience preferred; lift up to 40 lbs; operate cranes/hoists/lift trucks; drug screen and background check required; must be authorized to work in the U.S. without sponsorship...
Microsoft Windows, Microsoft Excel, Threading machine, Micrometer, Caliper, Crane, Hoist, Lift truck
Swiss American CDMO: Contract manufacturing for topical skin and wound care products.
5+ YOEMinimum 5 years engineering/R&D experience (CPG/personal care preferred), Master\u0002s preferred, experience with scale-up, GMP/OTC process or packaging engineering, bulk/packing equipment knowledge, strong analytical, communication, and project management skills.
Metrix: Designs and manufactures industrial vibration monitoring and protection systems.
1+ YOEHigh school diploma or equivalent; minimum 1 year warehouse/floor lift experience; able to operate forklift and floor jack; basic Microsoft Office skills; able to lift up to 45 lbs; strong attention to detail.
Microsoft Excel, Microsoft Word, Microsoft Outlook
DHL eCommerceFrankfurt Stock Exchange: DHL: Provides global e-commerce logistics and international shipping services.
Ability to sort and process parcels, follow instructions, lift up to 50 lbs, operate pallet jack, perform repetitive physical tasks, and work in varying temperatures.
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yrHybridFull Time
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Be 25 or older; read and speak English; valid driver’s license; able to operate a delivery van under 10,000 lbs; able to move boxes up to 50 lbs; able to work weekends.
Matheson: Supplying industrial, medical, and specialty gases and equipment.
1+ YOEDriver with Class B license, Hazmat, Air Brake Endorsements, Medical card; gas cylinder transport; 1 year road experience preferred; must be 21+; able to read/write English; physically capable of handling gas cylinders.