IntuitiveNASDAQ: ISRG: Global leader in robotic-assisted and minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
GoogleNASDAQ: GOOG, GOOGL: Global technology specializing in internet-related services and products.
5+ YOEBachelor's degree or equivalent practical experience, 5+ years in hardware or consumer-goods packaging design, ISTA and ASTM D4169 experience, and CAD proficiency. CPP, master's degree, and 8 years' experience preferred.
Wing: Alphabet-owned drone delivery serving homes and businesses with autonomous last-mile delivery of food, groceries, and essentials.
5+ YOERequires 5+ years in packaging, mechanical design, or industrial design; advanced packaging and structural mechanics knowledge; CAD and palletization software expertise; testing, documentation, collaboration, and travel ability.
Applied MaterialsNASDAQ: AMAT: Global leader in materials engineering for the semiconductor industry.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Managing R&D, selection, and implementation of manufacturing processes for consumer packaging parts and assemblies; strong product and process engineering skills.
Amperesand: Power infrastructure developing medium-voltage solid-state transformers for AI data centers and critical infrastructure.
3+ YOEBachelor's degree in mechanical engineering or related field, or equivalent experience; 3+ years designing component packaging from concept to production; expertise in CAD, CAE simulation, GD&T, tolerance analysis, and DFM/DFA.
CATIA, Solidworks, Ansys, Jira, Scrum, 3D EXPERIENCE, FEA
DensityAI: Semiconductor startup building full-stack AI accelerators for frontier-scale large language model inference.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
Delos Data: AI interconnect building server hardware and software for hyperscalers, AI infrastructure builders, and enterprises scaling inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
nEye: Private optical-switch building MEMS-based silicon-photonic circuit switches for hyperscale AI data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
12+ YOERequires a BS, MS, PhD, or equivalent in materials science, engineering, physics, or a related semiconductor field, plus 12+ years of IC packaging development or package design experience.
Molex: Electronic, electrical, and fiber-optic connectivity systems manufacturer serving automotive, industrial, medical, and data-center customers.
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Cspeed: Private semiconductor startup developing optical interconnects and photonic solutions for AI data-center infrastructure.
6+ YOE6+ years IC package physical design experience, BS/MS in electrical engineering, expertise in package layout tools, multi-die packaging, substrate stack-ups, DFM/DF A closure, and English fluency.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing, validating, and bringing up high-power-density, high-layer-count, large-format PCBs, with knowledge of chip-package interactions and design for manufacturing.
Qualcomm Technologies, Inc.: Developing semiconductor, wireless, connectivity, automotive, AI, and computing technologies for device and enterprise customers.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
5+ YOEM.S. or PhD in Mechanical Engineering/Materials Science or related field; 5+ years semiconductor IC packaging experience; experience with OSATs, flip-chip/leadframe/substrate packages, thermal/stress/electrical modeling; AutoCAD experience.