78 packaging design engineer jobs at 31 companies in Hollister, CA

3w
Save
Mark Applied
Hide
Packaging Design Engineer
San Jose or San Diego
HybridFull Time
AMD
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Cadence, SKILL, Ansys, AutoCAD
3mo
Save
Mark Applied
Hide
Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak
TransPak: Packaging, crating, and logistics serving technology, aerospace, defense, and medical customers with high-value, hard-to-ship goods.
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
3mo
Save
Mark Applied
Hide
Senior, Packaging Design Engineer
Sunnyvale, California, United States
$163k-$199k/yr OnsiteFull Time
Intuitive
IntuitiveNASDAQ: ISRG: Global leader in robotic-assisted and minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
1mo
Save
Mark Applied
Hide
Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
1w
Save
Mark Applied
Hide
Packaging Design Engineer, Platforms Infrastructure Engineering
Sunnyvale, California, United States
$159k-$230k/yr OnsiteFull Time
Google
GoogleNASDAQ: GOOG, GOOGL: Global technology specializing in internet-related services and products.
5+ YOEBachelor's degree or equivalent practical experience, 5+ years in hardware or consumer-goods packaging design, ISTA and ASTM D4169 experience, and CAD proficiency. CPP, master's degree, and 8 years' experience preferred.
ISTA, ASTM D4169, computer-aided design (CAD), Creo, NX, SolidWorks, TOPS, CAPE, FEA
2mo
Save
Mark Applied
Hide
Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Global leader in materials engineering for the semiconductor industry.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
2mo
Save
Mark Applied
Hide
Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Global leader in materials engineering for the semiconductor industry.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
2mo
Save
Mark Applied
Hide
Manufacturing Design Engineer (MDE) - Packaging
Cupertino, California, United States
OnsiteFull Time
Apple
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Managing R&D, selection, and implementation of manufacturing processes for consumer packaging parts and assemblies; strong product and process engineering skills.
1w
Save
Mark Applied
Hide
Packaging Tech Lead Design Engineer
San Jose, California, United States
$185k-$240k/yr OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Provider of connectivity solutions for AI data centers.
5+ YOEBachelor's degree in electrical or computer engineering and 5+ years of digital design experience, including a full chip from specification to tapeout. Requires Verilog/SystemVerilog, RTL, synthesis, timing closure, CDC, lint, and low-power expertise.
Verilog, SystemVerilog, RTL, CDC, DFT, BIST, PCIe, CXL, Ethernet, NVLink, UALink, UCIe, COSMOS, SoC
1mo
Save
Mark Applied
Hide
Principal Packaging Engineer, Optical Interfaces
Santa Clara, California, United States
$145k-$255k/yr OnsiteFull Time
nEye
nEye: Private optical-switch building MEMS-based silicon-photonic circuit switches for hyperscale AI data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
CAD, FEA
2mo
Save
Mark Applied
Hide
Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Global leader in analog and digital semiconductor technology.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
2w
Save
Mark Applied
Hide
Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
1mo
Save
Mark Applied
Hide
Senior IC Packaging Development Engineer
Santa Clara, California, United States
$168k-$345k/yr OnsiteFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
12+ YOERequires a BS, MS, PhD, or equivalent in materials science, engineering, physics, or a related semiconductor field, plus 12+ years of IC packaging development or package design experience.
Cadence Allegro Package Designer, ANSYS, ABAQUS, SEM, EDX, CSAM, X-Ray, LIT
1mo
Save
Mark Applied
Hide
Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
4w
Save
Mark Applied
Hide
Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
Broadcom Inc.
Broadcom Inc.NASDAQ: AVGO: Global technology leader in semiconductors and infrastructure software.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1mo
Save
Mark Applied
Hide
Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
1mo
Save
Mark Applied
Hide
IC Package Design Engineer
San Jose, California, United States
$153k-$219k/yr HybridFull Time
Cisco
CiscoNASDAQ: CSCO: Global leader in networking, cybersecurity, and cloud-native technology solutions.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
EDA, Python, Perl, TCL, Shell
3mo
Save
Mark Applied
Hide
Advanced Packaging SI/PI Engineer
San Jose, California, United States
$150k-$275k/yr OnsiteFull Time
Etched
Etched: Private semiconductor startup building AI inference chips, racks, and software for frontier-model customers.
8+ YOEBachelor's or Master's in Electrical/Computer Engineering; 8+ years SI/PI experience on high-performance ASIC/accelerator platforms; PDN design, high-speed interfaces; proficiency with SI/PI tools; packaging/OSAT/ODM collaboration.
ANSYS HFSS, SIwave, Cadence Sigrity, Keysight ADS
1mo
Save
Mark Applied
Hide
Package Design Engineer - Staff
Santa Clara or San Diego
$154k-$253k/yr OnsiteFull Time
Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc.: Developing semiconductor, wireless, connectivity, automotive, AI, and computing technologies for device and enterprise customers.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
Cadence APD, Cadence Allegro, PCB Editor, Advanced Package Designer, APD/SiP, XtractIM, PowerSI, HFSS, Q3D, Calibre
1mo
Save
Mark Applied
Hide
Principal Package Design Engineer
San Jose, California, United States
$195k-$240k/yr HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Global provider of embedded semiconductor and system solutions.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Cadence Allegro Package Designer, Solid works, ANSYS, COMSOL, JMP, Minitab