78 packaging design engineer jobs at 31 companies in Hollister, CA
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Packaging Design Engineer
San Jose or San Diego
HybridFull Time
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
IntuitiveNASDAQ: ISRG: Global leader in robotic-assisted and minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
GoogleNASDAQ: GOOG, GOOGL: Global technology specializing in internet-related services and products.
5+ YOEBachelor's degree or equivalent practical experience, 5+ years in hardware or consumer-goods packaging design, ISTA and ASTM D4169 experience, and CAD proficiency. CPP, master's degree, and 8 years' experience preferred.
Applied MaterialsNASDAQ: AMAT: Global leader in materials engineering for the semiconductor industry.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Applied MaterialsNASDAQ: AMAT: Global leader in materials engineering for the semiconductor industry.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
AppleNASDAQ: AAPL: Designing and manufacturing consumer electronics, software, and digital services.
Managing R&D, selection, and implementation of manufacturing processes for consumer packaging parts and assemblies; strong product and process engineering skills.
Astera LabsNASDAQ: ALAB: Provider of connectivity solutions for AI data centers.
5+ YOEBachelor's degree in electrical or computer engineering and 5+ years of digital design experience, including a full chip from specification to tapeout. Requires Verilog/SystemVerilog, RTL, synthesis, timing closure, CDC, lint, and low-power expertise.
nEye: Private optical-switch building MEMS-based silicon-photonic circuit switches for hyperscale AI data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
Analog DevicesNASDAQ: ADI: Global leader in analog and digital semiconductor technology.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
12+ YOERequires a BS, MS, PhD, or equivalent in materials science, engineering, physics, or a related semiconductor field, plus 12+ years of IC packaging development or package design experience.
Broadcom Inc.NASDAQ: AVGO: Global technology leader in semiconductors and infrastructure software.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
CiscoNASDAQ: CSCO: Global leader in networking, cybersecurity, and cloud-native technology solutions.
3+ YOEBachelor's (5+ years) or Master’s (3+ years) in Electrical Engineering or related field; experience in package/PCB/high-speed design, power delivery, and EDA tools; scripting (Python, Perl, TCL, shell) and strong collaboration skills.
Etched: Private semiconductor startup building AI inference chips, racks, and software for frontier-model customers.
8+ YOEBachelor's or Master's in Electrical/Computer Engineering; 8+ years SI/PI experience on high-performance ASIC/accelerator platforms; PDN design, high-speed interfaces; proficiency with SI/PI tools; packaging/OSAT/ODM collaboration.
Qualcomm Technologies, Inc.: Developing semiconductor, wireless, connectivity, automotive, AI, and computing technologies for device and enterprise customers.
5+ YOEExperience in IC package/SIP physical design, Cadence APD/Allegro proficiency, familiarity with SI/PI tools (HFSS, PowerSI, Q3D), package verification and CAD tool development; master\u0002s preferred with 5+ years.
Renesas ElectronicsTokyo Stock Exchange: 6723: Global provider of embedded semiconductor and system solutions.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.