32 packaging design engineer jobs at 23 companies in Woonsocket, RI
1mo
Save
Mark Applied
Hide
1mo
IC Packaging Design & Layout Engineer
Cambridge, Massachusetts, United States
$82k-$220k/yrOnsiteFull Time
Draper: Independent research and development organization focused on national challenges.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing or developing processes for complex packages; first-principles problem solving. Preferred: heterogeneous materials, high-TDP packages, compound semiconductors, optics, interposers, flip-chip integration, or large substrates.
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Global provider of automated test equipment and industrial robotics.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yrOnsiteFull Time
MACOM Technology SolutionsNASDAQ: MTSI: Provider of high-performance analog semiconductor solutions.
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
WHOOP: Wearable technology developing health and fitness tracking devices.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Galaxy Integrated Technologies: Privately owned commercial security and low-voltage systems integrator serving businesses, government, schools, and healthcare organizations.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
CSL Behring: Global biotherapeutics leader driven by our promise to save lives.
5+ YOEBachelor's degree in engineering, life sciences, or related field; 5+ years in medical device, combination product, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, FMEA, Design Controls
MarvellNASDAQ: MRVL: Global leader in data infrastructure semiconductor solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yrHybridFull Time
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
CSL SeqirusASX: CSL: Global biotechnology developing biotherapies and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in medical devices, combination products, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls; knowledge of FDA, EU MDR, ISO 13485, and ISO 14971.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, EU MDR, FMEA
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Global leader in networking, cybersecurity, and cloud-native technology solutions.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
Centessa PharmaceuticalsNASDAQ: CNTA: Lilly-owned clinical-stage biopharmaceutical developing orexin receptor 2 agonists for patients with sleep-wake disorders.
8+ YOEBachelor’s degree in a related scientific or engineering field and 8–10 years of sponsor-side pharmaceutical packaging experience, including late-stage or commercial programs, technical leadership, technology transfer, and cGMP expertise.
IPG MedicalNasdaq Global Select Market: IPGP: The Global Leader in Fiber Laser Technology
10+ YOEBSME/MSME preferred; 10+ years in mechanical design for laser/optical/medical devices; strong PM/leadership; SOLIDWORKS with PDM; packaging, opto-mechanical, electronics interface; MS Office;
SOLIDWORKS, SOLIDWORKS PDM, MS Office, Visio, Project