48 packaging design jobs at 26 companies in Lakeway, TX
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Senior Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOE6+ years packaging design experience; portfolio of FMCG/CPG work; structural packaging, print production, labeling, vendor management, and strong storytelling skills.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, ArtiosCAD, Cinema 4D
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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
4w
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Packaging and Graphic Designer 2
Austin, Texas, United States
$102k-$132k/yr OnsiteFull Time
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
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Packaging Engineer Aurora
New Braunfels or United States
OnsiteFull Time
2+ YOEBachelor's degree in a technical discipline or related field; packaging design or engineering knowledge, strong problem-solving and communication skills. Two years of packaging experience and CAD experience are preferred.
SAP, SupplyOn, CAD
4d
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Collaborates on structural packaging design and execution, balancing customer experience, product protection, sustainability, and cross-functional design requirements.
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
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Senior Manager, Pricing & Packaging
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yr HybridFull Time
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Microsoft Excel, Microsoft PowerPoint
2w
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
3d
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CPU Core Physical Design Thermal Modeling Lead
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yr HybridFull Time
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
EDA, SoC, IP
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PCB Design Engineering Section Lead
Hudson or Fort Wayne or Austin
$133k-$226k/yr OnsiteFull Time
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
Cadence Allegro, IPC
2mo
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Sr. Engineer, Package Design
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yr HybridFull Time
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Cadence Allegro PCB Designer
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Physical Design - SOC Top Lead
San Jose or Pittsburgh or Austin
$200k-$250k/yr OnsiteFull Time
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
Innovus, ICC2, Tempus, PrimeTime, RedHawk, Calibre, Voltus, TCL, shell, python
2mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
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Senior IC Package Design Engineer - TeraWave
San Diego or Austin or California
$230k-$323k/yr OnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEBachelor's in EE or related,7+ years industry experience delivering IC packaging,expertise with HFSS/EMX/Momentum,Cadence Allegro experience preferred,RF/mmWave and power/signal integrity expertise,U.S. work authorization required.
HFSS, EMX, Momentum, Cadence Allegro
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
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Graphic Designer Lead
Austin, Texas, United States
HybridFull Time
7+ YOEBachelor's degree in graphic design, visual communications, or related field, or equivalent experience; 7+ years of graphic design experience; Adobe Creative Cloud expertise; UX/UI, web, packaging, photography, and video production experience.
Adobe Creative Cloud, Adobe Photoshop, Adobe Illustrator, Adobe InDesign, Adobe After Effects, HTML, CSS
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Principal EDA R&D Engineer, Advanced Packaging
Austin, Texas, United States
$166k-$249k/yr OnsiteFull Time
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
C++, Python, TCL, ODB++