43 packaging design jobs at 23 companies in Leander, TX
16h
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Senior Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOE6+ years packaging design experience; portfolio of FMCG/CPG work; structural packaging, print production, labeling, vendor management, and strong storytelling skills.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, ArtiosCAD, Cinema 4D
1mo
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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
1mo
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AI Automation Design Packaging Lead
Austin, Texas, United States
$163k-$244k/yr HybridFull Time
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
2w
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Packaging and Graphic Designer 2
Austin, Texas, United States
$102k-$132k/yr OnsiteFull Time
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
6h
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Collaborates on structural packaging design and execution, balancing customer experience, product protection, sustainability, and cross-functional design requirements.
6d
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1mo
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
1w
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
1mo
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Senior Manager, Pricing & Packaging
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yr HybridFull Time
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Microsoft Excel, Microsoft PowerPoint
1w
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
1mo
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Sr. Engineer, Package Design
Santa Clara or Austin or Toronto or New Taipei City
$100k-$500k/yr HybridFull Time
3+ YOE3+ years experience with Cadence Allegro PCB Designer, PCB routing and BGA design, signal and power integrity knowledge, strong communication and cross-discipline collaboration skills.
Cadence Allegro PCB Designer
1d
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Physical Design - SOC Top Lead
San Jose or Pittsburgh or Austin
$200k-$250k/yr OnsiteFull Time
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
Innovus, ICC2, Tempus, PrimeTime, RedHawk, Calibre, Voltus, TCL, shell, python
2mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
1w
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Senior IC Package Design Engineer - TeraWave
San Diego or Austin or California
$230k-$323k/yr OnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEBachelor's in EE or related,7+ years industry experience delivering IC packaging,expertise with HFSS/EMX/Momentum,Cadence Allegro experience preferred,RF/mmWave and power/signal integrity expertise,U.S. work authorization required.
HFSS, EMX, Momentum, Cadence Allegro
2mo
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
1mo
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
1d
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Staff Signal Integrity Engineer, Electrical Design
Austin, Texas, United States
$128k-$200k/yr OnsiteFull Time
7+ YOEBachelor's degree in electrical engineering or similar and 7–10 years of related experience. Requires signal and power integrity, package and PCB modeling, and simulation expertise.
Hspice, Sigrity, ADS, Ansys SIwave, HFSS 3D
1w
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Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
1mo
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Mechanical Engineer, Staff to Principal level
Austin, Texas, United States
$110k-$183k/yr OnsiteFull Time
8+ YOEExperienced mechanical design engineer for high-power electrical equipment; strong busbar, wire-harness, board-packaging, insulation coordination, manufacturability, FEA/CFD, and SolidWorks skills; mentoring experience.
SolidWorks, FEA, CFD, CNC
2w
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Hardware Engineering Lead
Endicott or Austin
$121k-$205k/yr OnsiteFull Time
8+ YOEBachelor's degree with 8+ years or 15+ years related experience; expertise in electronics packaging, CCA/PWB mechanical design, environmental test planning, DFM, drawing/configuration control; U.S. person required.