38 packaging design jobs at 25 companies in Phoenix, AZ
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yrOnsiteFull Time
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
PetSmart: Retailer of pet supplies, food, and grooming services.
2+ YOEBachelor’s in Graphic Design; 2+ years package design; strong typography, color, layout; production and printing knowledge; proficient in Adobe CC.
Adobe Creative Cloud, Illustrator, Photoshop, InDesign, DAM systems, FTP
Advanced Process Chemical Design & Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in design/permitting/project engineering for chemical/utility/MEP systems; experience preparing construction drawings, permit packages, AHJ coordination; proficiency with AutoCAD, Bluebeam, Revit; strong organization and communication.
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Phoenix or Arizona or Illinois or New Jersey or New York
RemoteMultiple Commitments Available
OGeez! Brands: Produces and distributes cannabis-infused gummies and confectionery products.
8+ YOE8+ years in branding, packaging, and creative direction for consumer goods; portfolio required; Adobe Creative Suite proficiency; experience with packaging, dielines, production, vendor management, and creative strategy.
Arizona Public ServiceNYSE: PNW: Provides electric utility services to customers throughout Arizona.
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
HDR: Global firm providing architecture, engineering, and environmental services.
Bachelor's degree; EIT preferred; experience in bridge/structural design; familiarity with engineering software packages listed; proficient in MS Office and AutoCAD.
Austin Industries: Provides civil, commercial, and industrial construction and maintenance services.
3+ YOE3+ years piping design experience in industrial construction; proficiency with PDMS, E3D, AutoCAD Plant 3D, SmartPlant 3D or CADWorx; ability to interpret P&IDs, produce isometrics, BOMs and fabrication packages.
PDMS, E3D, AutoCAD Plant 3D, CADWorx, SmartPlant 3D
Hartford or Indianapolis or Phoenix or Raleigh or Richardson
$102k-$164k/yrOnsiteFull Time
InfosysNYSE: INFY: Provides IT consulting, software development, and business outsourcing services.
Bachelor's degree or equivalent, experience with Oracle CX Cloud (Fusion Service Cloud, Engagement Cloud), BI Publisher, Groovy scripting, integrations and full project lifecycle; ability to design solutions, configure and deploy Oracle Cloud packages; US work authorization required.
Oracle CX Cloud, Fusion Service Cloud, Engagement Cloud, BI Publisher, Oracle Order Management Cloud, Subscription Management Cloud, Oracle Inventory Cloud, Oracle Maintenance Cloud, Oracle Service Logistics Cloud, Oracle Cloud, Application Composer, Page Composer, Groovy Scripting, Redwood UX, Visual Builder, Webservices
The Kroger Co.NYSE: KR: Operates supermarkets, pharmacies, and jewelry stores across America.
Provide customer service, design and package floral arrangements, operate cash register, read labels and signage, follow safety and sanitation procedures, and work weekends/holidays.
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
AdvantestTokyo Stock Exchange: 6857: Manufacturer of automated test systems for the semiconductor industry.
15+ YOE15+ years leadership in semiconductor/interconnect/advanced packaging; deep SI/PI and socket/interconnect design expertise; proven R&D-to-HVM scaling; executive global engineering leadership; DFA and factory automation experience.
Mechanicsburg or Dallas or United States or Denver or Salt Lake City or Indianapolis or Cincinnati or Charlotte or Roanoke or Marlton or Pittsburgh or St. Louis or Chicago or Phoenix
$90k-$125k/yrRemoteFull Time
GFT (Gannett Fleming): Provides infrastructure engineering, design, and construction management services.
3+ YOEBachelor's in civil/electrical/structural engineering, 3+ years transmission line design, high proficiency in PLS-CADD, knowledge of NESC/IEEE codes, ability to prepare construction packages, travel to client sites; PE preferred.
CommonSpirit Health: Large non-profit healthcare system providing hospital and medical services.
Doctor of Medicine (MD) or Ph.D. required; experience with statistical packages (R or Stata); proven research design, execution, manuscript and grant contribution; preferred 5 years post-degree research/data analysis and epidemiology background.