48 packaging designer jobs at 25 companies in Bastrop, TX
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Senior Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOE6+ years packaging design experience; portfolio of FMCG/CPG work; structural packaging, print production, labeling, vendor management, and strong storytelling skills.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, ArtiosCAD, Cinema 4D
1mo
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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
3w
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Packaging and Graphic Designer 2
Austin, Texas, United States
$102k-$132k/yr OnsiteFull Time
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
1mo
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Senior Manager, Pricing & Packaging
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yr HybridFull Time
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Microsoft Excel, Microsoft PowerPoint
1w
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Collaborates on structural packaging design and execution, balancing customer experience, product protection, sustainability, and cross-functional design requirements.
2w
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Electric Utility Field Designer
Austin, Texas, United States
FieldFull Time
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
6d
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Principal EDA R&D Engineer, Advanced Packaging
Austin, Texas, United States
$166k-$249k/yr OnsiteFull Time
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
C++, Python, TCL, ODB++
5d
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Staff Package Design Engineer
Plano or Austin or Tempe
HybridFull Time
4+ YOE4+ years in package CAD layout, substrate design, or advanced packaging; package design tools; semiconductor packaging, design rules, manufacturing, SI/PI, routing, and cross-functional engineering experience.
Cadence Allegro Package Designer, SiP Layout, Siemens Xpedition Substrate Integrator, Gerber
2w
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
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Design & Verification Engineer, Analog Power Management (7682)
Austin, Texas, United States
$120k-$170k/yr OnsiteMultiple Commitments Available
7+ YOEMSEE with 7+ years in power management design/verification; SIMPLIS experience; PCB design/layout for power; IC design/packaging; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
5d
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
2mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
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AI and Design Automation Engineer
Austin, Texas, United States
HybridFull Time
Bachelor's degree in EE/CE/CS or related; expertise in package/design automation, EDA tools, scripting (Python/Tcl/SKILL/C++), and applying AI/ML to design workflows.
Cadence APD / SiP, Siemens Xpedition, Synopsys 3DICC, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
2mo
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Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yr OnsiteFull Time
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling
SIMPLIS, PCB Design, Power Delivery Modeling
2w
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Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
1w
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Physical Design - SOC Top Lead
San Jose or Pittsburgh or Austin
$200k-$250k/yr OnsiteFull Time
8+ YOEEnd-to-end SOC top ownership including full-chip integration, timing closure, power/PDN analysis, physical verification, SI, clock/reset, DFT, package co-design, and tapeout readiness; advanced degree in EE and extensive PD experience.
Innovus, ICC2, Tempus, PrimeTime, RedHawk, Calibre, Voltus, TCL, shell, python
1mo
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Mechanical Engineer, Staff to Principal level
Austin, Texas, United States
$110k-$183k/yr OnsiteFull Time
8+ YOEExperienced mechanical design engineer for high-power electrical equipment; strong busbar, wire-harness, board-packaging, insulation coordination, manufacturability, FEA/CFD, and SolidWorks skills; mentoring experience.
SolidWorks, FEA, CFD, CNC
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