54 packaging designer jobs at 27 companies in Lago Vista, TX
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Senior Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOE6+ years packaging design experience; portfolio of FMCG/CPG work; structural packaging, print production, labeling, vendor management, and strong storytelling skills.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, ArtiosCAD, Cinema 4D
1mo
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Sr. Packaging Designer
Austin, Texas, United States
HybridFull Time
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Adobe Creative Suite, Illustrator, Photoshop, InDesign, CAD
1mo
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Packaging and Graphic Designer 2
Austin, Texas, United States
$102k-$132k/yr OnsiteFull Time
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
1w
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Graphic Designer Lead
Austin, Texas, United States
HybridFull Time
7+ YOEBachelor's degree in graphic design, visual communications, or related field, or equivalent experience; 7+ years of graphic design experience; Adobe Creative Cloud expertise; UX/UI, web, packaging, photography, and video production experience.
Adobe Creative Cloud, Adobe Photoshop, Adobe Illustrator, Adobe InDesign, Adobe After Effects, HTML, CSS
2d
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Packaging Engineer Aurora
New Braunfels, Texas, United States
OnsiteFull Time
Bachelor's degree in a technical field required. Requires packaging design or engineering knowledge, problem-solving and communication skills; 2 years packaging experience and CAD experience are preferred.
SAP, SupplyOn, CAD
1mo
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AI Automation Design Packaging Lead
Austin, Texas, United States
$163k-$244k/yr HybridFull Time
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Cadence APD/SIP, Siemens Xpedition, Synopsys 3DIC/Compiler, Python, Tcl, SKILL, C++, PyTorch, TensorFlow
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Senior Manager, Pricing & Packaging
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yr HybridFull Time
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Microsoft Excel, Microsoft PowerPoint
2w
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Collaborates on structural packaging design and execution, balancing customer experience, product protection, sustainability, and cross-functional design requirements.
1w
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Senior Design Lead - Technomatix and Mechanical Assembly - DFM
Austin, Texas, United States
$80k-$122k/yr OnsiteFull Time
Bachelor's degree or equivalent experience in manufacturing, engineering, packaging, or industrial design; CAD and technical drawing knowledge; manufacturing, materials, packaging testing, risk management, and communication expertise.
CAD, GD&T, ASTM, Mil-Spec
4d
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Designer & Detailer (Electrical/Controls), Modular R&D
Austin or New York City or San Francisco or Seattle
$134k-$164k/yr OnsiteFull Time
Experience detailing electrical or controls packages for fabrication or modular assemblies; daily electrical CAD work; expertise with wiring diagrams, cable schedules, revisions, standards, libraries, templates, and installation-level drawings.
AutoCAD Electrical, EPLAN, Revit, Plant 3D
3w
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Electric Utility Field Designer
Austin, Texas, United States
FieldFull Time
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
1w
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Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, Perl, ARM, TCL, Skill, Ravel, DRC
2w
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Principal EDA R&D Engineer, Advanced Packaging
Austin, Texas, United States
$166k-$249k/yr OnsiteFull Time
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
C++, Python, TCL, ODB++
3w
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
2mo
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
2w
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
3w
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
1w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
3mo
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Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
Cadence APD+/SIP, SIWave, HFSS, ADS, Package design tools
6d
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PCB Design Engineering Section Lead
Hudson or Fort Wayne or Austin
$133k-$226k/yr OnsiteFull Time
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
Cadence Allegro, IPC
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