Nutrabolt: Produces performance sports nutrition products and energy drinks.
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
AumovioFrankfurt Stock Exchange: AMV0: Manufactures electronics and software for autonomous and connected vehicles.
2+ YOEBachelor's degree in a technical discipline or related field; packaging design or engineering knowledge, strong problem-solving and communication skills. Two years of packaging experience and CAD experience are preferred.
Pratt Industries: Manufactures recycled paper packaging and provides waste recycling services.
3+ YOERequires high school diploma/GED, with 3–5 years of corrugated packaging or related experience preferred; preferred tools include ArtiosCAD, Kongsberg table, TOPS Software, and Microsoft Office.
ArtiosCAD, Kongsberg table, TOPS Software, Microsoft Office, CAD
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yrHybridFull Time
Zendesk: Provides cloud-based software for customer service and support.
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
SEnergy: Provides electrical engineering and consulting for utility providers.
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
SynopsysNasdaq: SNPS: Provides software and IP for semiconductor design and manufacturing.
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Design & Verification Engineer, Analog Power Management (7682)
Austin, Texas, United States
$120k-$170k/yrOnsiteMultiple Commitments Available
TSMCNew York Stock Exchange: TSM: Manufactures semiconductor chips and integrated circuits for global customers.
7+ YOEMSEE with 7+ years in power management design/verification; SIMPLIS experience; PCB design/layout for power; IC design/packaging; strong teamwork; power delivery modeling
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yrHybridFull Time
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Bachelor's degree in EE/CE/CS or related; expertise in package/design automation, EDA tools, scripting (Python/Tcl/SKILL/C++), and applying AI/ML to design workflows.
Design & Verification Engineer, Analog Power Management (7682) (Austin, TX, US)
Austin, Texas, United States
$120k-$170k/yrOnsiteFull Time
TSMCNew York Stock Exchange: TSM: Manufactures advanced semiconductor integrated circuits for global technology companies.
7+ YOEMSEE with 7+ years in hands-on power management design/verification; SIMPLIS knowledge; PCB design/layout in PM; IC design/packaging familiarity; strong teamwork; power delivery modeling