Nutrabolt: Produces performance sports nutrition products and energy drinks.
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
A. O. SmithNYSE: AOS: Manufactures residential and commercial water heaters and boilers.
7+ YOEBachelor's degree in graphic design, visual communications, or related field, or equivalent experience; 7+ years of graphic design experience; Adobe Creative Cloud expertise; UX/UI, web, packaging, photography, and video production experience.
PepsiCoNASDAQ: PEP: Produces and distributes global snack and beverage products.
3+ YOE3+ years of graphic design experience, portfolio, advanced Adobe Creative Suite and Microsoft Suite knowledge, print and packaging production expertise, and project ownership skills.
PepsiCoNASDAQ: PEP: Global manufacturer and distributor of snacks and beverages.
3+ YOERequires 3+ years of graphic design experience, portfolio, print and packaging production expertise, adaptability, and advanced Adobe Creative Suite, Microsoft Suite, and project management tool knowledge.
PepsiCoNASDAQ: PEP: Global food and beverage manufacturer and distributor.
3+ YOERequires 3+ years of graphic design experience, a portfolio, advanced Adobe Creative Suite and Microsoft Suite knowledge, print and packaging production expertise, and proficiency with project management tools.
Nood: Sells at-home light-based hair removal devices and companion skincare.
8+ YOERequires 8+ years of design experience, strong portfolio across branding, packaging, digital and performance creative, expertise in typography and visual storytelling, and proficiency in Adobe Creative Suite and Figma.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Technical leader to develop and deploy AI-driven packaging design automation. Requires bachelor's or master's in EE/CE/CS, experience with EDA tools, scripting (Python/Tcl/SKILL/C++), AI/ML frameworks, and cross-functional leadership.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027)
Austin, Texas, United States
$78k-$82k/yrFieldFull Time
Dennis Group: A design-build engineering firm and general contractor specializing in food and beverage processing facilities.
0+ YOEBachelor’s degree in mechanical, packaging, industrial, or manufacturing engineering; 0–3 years of relevant experience or schooling; MS Office, MS Project, and AutoCAD familiarity; strong communication and problem-solving skills.
Certain Affinity: Develops and-develops action-oriented multiplayer AAA video games.
4+ YOERequires 4+ years as a scripter or technical designer, Unreal Engine and Blueprint expertise, 2+ years with Unreal 5, programming experience, and a shipped title; AAA experience and related degree preferred.
SEnergy: Provides electrical engineering and consulting for utility providers.
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
SynopsysNasdaq: SNPS: Provides software and IP for semiconductor design and manufacturing.
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.