33 packaging designer jobs at 26 companies in Marshfield, MA
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Graphic Designer / Packaging Expert
Framingham, Massachusetts, United States
$60k-$80k/yrOnsiteFull Time
52Launch: Product development studio taking ideas from concept to market.
5+ years of graphic design experience with a strong packaging portfolio; expertise in Adobe Creative Suite, packaging production, dielines, print specifications, file preparation, color theory, typography, layout, and brand systems.
Morristown or Swiftwater or Cambridge or Northborough
$71k-$103k/yrOnsiteFull Time
SanofiEuronext Paris: SAN: Researches, develops, and manufactures medicines and vaccines globally.
1+ YOEBachelor's in graphic design, 1+ years design experience, proficiency with artwork file management and MAC systems, ability to read packaging specifications and follow GMP/regulatory requirements.
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster’s or PhD in electrical, mechanical, or materials science engineering; 2+ years in semiconductor packaging development or manufacturing; package design, simulation, materials, assembly, and reliability expertise.
WHOOP: Wearable technology for personalized health and performance tracking.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
Barry-Wehmiller: Manufactures industrial machinery for packaging and paper processing.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Helen of TroyNASDAQ: HELE: Designs and markets branded consumer housewares and personal care products.
15+ YOEBFA in Graphic Design or equivalent experience, 15+ years in graphic and package design, expert Adobe Creative Suite knowledge, team leadership experience, and US work authorization.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
HybridInternship, Temporary
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Currently enrolled in a US bachelor's program in engineering or a related field; knowledge of circuits, package or PCB design, Perl, Python, SQL, semiconductor packaging, or data analytics is encouraged.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
Infineon TechnologiesFrankfurt Stock Exchange: IFX: Designs and manufactures semiconductors for power and IoT systems.
6+ YOETechnical degree in physics or electronics preferred, 6+ years experience in assembly/Back End technologies, SMT knowledge, experience with package design tools (AutoCAD, Cadence), strong communication and presentation skills.