110 packaging designer jobs at 62 companies in Pacifica, CA
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TEMP Packaging Designer
San Francisco, California, United States
$45-$55/hrHybridFull Time, Temporary
Kendo BrandsEuronext Paris: MC: Incubates and develops global prestige beauty and skincare brands.
5+ YOE5+ years design experience (1+ year packaging), BA in design preferred, Adobe CC proficiency (Illustrator, Photoshop, InDesign), strong communication, organization, and ability to meet tight deadlines.
Publicis GroupeEuronext Paris: PUB: Global communications, advertising, and digital transformation holding.
5+ YOE5+ years agency experience preferred; multidisciplinary experience in brand identity, design systems and packaging; mastery of Adobe Suite and Figma; strong communication and production skills.
Publicis GroupeEuronext Paris: PUB: Global advertising and digital transformation agency holding.
5+ YOE5+ years agency experience preferred; multidisciplinary experience in brand identity, design systems and packaging; mastery of Adobe Suite and Figma; strong craft, communication, and organizational skills.
Mochi Health: Provides telehealth weight management and prescription medication services.
3+ YOE3+ years brand design experience, portfolio required, proficiency with Figma, Photoshop, Illustrator, experience with brand identity systems and visual design across packaging and advertising.
Benefit Cosmetics: Sells high-end makeup products and provides professional eyebrow styling.
6+ YOE6+ years design experience (packaging a plus), strong concepting and print production knowledge, advanced industry-standard software skills, project management proficiency, sustainability experience, and ability to collaborate cross-functionally.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
WingNASDAQ: GOOGL: Autonomous drone delivery service for small packages and logistics
5+ YOERequires 5+ years in packaging, mechanical design, or industrial design; advanced packaging and structural mechanics knowledge; CAD and palletization software expertise; testing, documentation, collaboration, and travel ability.
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
Central Garden & PetNASDAQ: CENT: Manufacturer and distributor of lawn, garden, and pet products.
3+ YOE3+ years packaging/graphic design experience in CPG or retail, strong stakeholder partnership and project management, proficiency in Adobe Creative Suite and Wrike, bachelor's degree or equivalent, portfolio required.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
10+ YOEBachelor's degree in packaging or engineering plus 10 years of relevant industry experience and cGMP experience. Requires packaging engineering leadership, combination products, design controls, risk management, and regulatory knowledge.
ISO 11607, ISO 14971, FDA, EU MDR, 21 CFR, ASTM, ISTA, Workday
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.