34 packaging designer jobs at 27 companies in Quincy, MA
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Senior Designer, Packaging & Retail
Boston or New York City or United States
HybridFull Time
Beam: Wellness brand selling science-backed supplements and functional products.
3+ YOE3+ years design experience (CPG preferred); strong packaging production and dieline knowledge; proficiency in Adobe Creative Suite (Illustrator, InDesign, Photoshop); strong attention to detail and project management skills.
Morristown or Swiftwater or Cambridge or Northborough
$71k-$103k/yrOnsiteFull Time
SanofiEuronext Paris: SAN: Researches, develops, and manufactures medicines and vaccines globally.
1+ YOEBachelor's in graphic design, 1+ years design experience, proficiency with artwork file management and MAC systems, ability to read packaging specifications and follow GMP/regulatory requirements.
Lacerta Group: Manufactures thermoformed plastic packaging for food and retail products.
3+ YOE3+ years product or packaging design experience; proficiency with SolidWorks/AutoCAD; experience with thermoforming/extrusion and manufacturability; Associate's or Bachelor's in design/engineering preferred.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
10+ YOEAssociate's degree in mechanical CAD design or related plus 10+ years related experience; ability to obtain Secret clearance; electro-mechanical packaging experience; proficiency with PTC Creo Parametric and Windchill; GD&T/ASME knowledge.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
WHOOP: Wearable technology for personalized health and performance tracking.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
Barry-Wehmiller: Manufactures industrial machinery for packaging and paper processing.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
BAE SystemsLondon Stock Exchange: BA.: Produces advanced defense, aerospace, and information security systems.
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yrHybridFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
Infineon TechnologiesFrankfurt Stock Exchange: IFX: Designs and manufactures semiconductors for power and IoT systems.
6+ YOETechnical degree in physics or electronics preferred, 6+ years experience in assembly/Back End technologies, SMT knowledge, experience with package design tools (AutoCAD, Cadence), strong communication and presentation skills.