36 packaging designer jobs at 29 companies in Randolph, MA
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Graphic Designer / Packaging Expert
Framingham, Massachusetts, United States
$60k-$80k/yrOnsiteFull Time
52Launch: Product development studio taking ideas from concept to market.
5+ years of graphic design experience with a strong packaging portfolio; expertise in Adobe Creative Suite, packaging production, dielines, print specifications, file preparation, color theory, typography, layout, and brand systems.
Morristown or Swiftwater or Cambridge or Northborough
$71k-$103k/yrOnsiteFull Time
SanofiEuronext Paris: SAN: Researches, develops, and manufactures medicines and vaccines globally.
1+ YOEBachelor's in graphic design, 1+ years design experience, proficiency with artwork file management and MAC systems, ability to read packaging specifications and follow GMP/regulatory requirements.
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
10+ YOEAssociate's degree in mechanical CAD design or related plus 10+ years related experience; ability to obtain Secret clearance; electro-mechanical packaging experience; proficiency with PTC Creo Parametric and Windchill; GD&T/ASME knowledge.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster’s or PhD in electrical, mechanical, or materials science engineering; 2+ years in semiconductor packaging development or manufacturing; package design, simulation, materials, assembly, and reliability expertise.
WHOOP: Wearable technology for personalized health and performance tracking.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
Barry-Wehmiller: Manufactures industrial machinery for packaging and paper processing.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
Degree-level qualification or equivalent education and experience. Requires labeling, packaging graphics, regulatory compliance, cross-functional collaboration, project prioritization, and medical device or drug documentation experience.
BAE SystemsLondon Stock Exchange: BA.: Produces advanced defense, aerospace, and information security systems.
Bachelor's degree in engineering, broad military electronics packaging design experience, organizational leadership, strong PCB design background, communication skills, and ability to obtain Secret clearance.
Santa Clara or Austin or Fort Collins or Boxborough
$175k-$300k/yrHybridFull Time
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Requires a bachelor's or master's degree in computer or electrical engineering, strong physical design and EDA experience, SoC/IP design knowledge, package modeling familiarity, and scripting and flow automation expertise.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.