Nutrabolt: Produces performance sports nutrition products and energy drinks.
6+ YOEBachelor's in design, 6+ years packaging design experience, strong portfolio, expertise in dielines/prepress/production, Adobe Creative Suite proficiency, experience from concept through manufacturing, and familiarity with AI/3D tools preferred.
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
Packaging Corporation of AmericaNYSE: PKG: Manufactures containerboard and corrugated packaging products for diverse industries.
4+ YOEBachelor's in design/engineering/packaging required, 4+ years packaging/POP design experience, strong knowledge of production and printing methods, proficiency with Microsoft Word/Excel/Outlook and CAD, strong communication and problem-solving skills.
Microsoft Word, Microsoft Excel, Microsoft Outlook, Computer Assisted Design (CAD), PCA design software
A. O. SmithNYSE: AOS: Manufactures residential and commercial water heaters and boilers.
7+ YOEBachelor's degree in graphic design, visual communications, or related field, or equivalent experience; 7+ years of graphic design experience; Adobe Creative Cloud expertise; UX/UI, web, packaging, photography, and video production experience.
California or Colorado or Texas or Austin or Massachusetts or New York or Georgia
$140k-$210k/yrHybridFull Time
Zendesk: Provides cloud-based software for customer service and support.
8+ YOE8+ years relevant experience, strong analytical and communication skills, advanced Excel and PowerPoint, experience designing qualitative and quantitative research, Bachelor’s in Business/Finance/Economics or related field required.
Entry Level Packaging Systems Design Engineer I (Start Summer 2027)
Austin, Texas, United States
$78k-$82k/yrFieldFull Time
Dennis Group: A design-build engineering firm and general contractor that plans, designs, engineers, and builds food and beverage processing facilities.
0+ YOEBachelor's degree in mechanical, packaging, industrial, or manufacturing engineering; 0–3 years of relevant work or schooling; MS Office, MS Project, and AutoCAD familiarity; strong communication and problem-solving skills.
Certain Affinity: Develops and-develops action-oriented multiplayer AAA video games.
4+ YOERequires 4+ years as a scripter or technical designer, Unreal Engine and Blueprint expertise, 2+ years with Unreal 5, programming experience, and a shipped title; AAA experience and related degree preferred.
Senior Design Lead - Technomatix and Mechanical Assembly - DFM
Austin, Texas, United States
$80k-$122k/yrOnsiteFull Time
HCLTechNational Stock Exchange of India: HCLTECH: Global technology providing digital, engineering, and cloud services.
Bachelor's degree or equivalent experience in manufacturing, engineering, packaging, or industrial design; CAD and technical drawing knowledge; manufacturing, materials, packaging testing, risk management, and communication expertise.
SEnergy: Provides electrical engineering and consulting for utility providers.
High school diploma required; two-year technical degree preferred. Ability to review field notes, create AutoCAD drawings, compile construction packages, use NISC/NIS/Partner/Futura/AeGIS and Microsoft Office. Strong communication and time-management skills.
AutoCAD, NISC, NIS, Partner, Futura, AeGIS, Microsoft Excel, Microsoft Word, Microsoft Outlook
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
SynopsysNasdaq: SNPS: Provides software and IP for semiconductor design and manufacturing.
10+ YOEBachelor's or master's degree or equivalent experience; 10+ years in EDA software development; expertise in package substrate design, automation, computational geometry, and programming with Python or TCL.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yrHybridFull Time
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.