51 packaging designer jobs at 29 companies in Westminster, MA
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Graphic Designer / Packaging Expert
Framingham, Massachusetts, United States
$60k-$80k/yrOnsiteFull Time
52Launch: Private U.S. product-development agency helping entrepreneurs and growing businesses design, manufacture, brand, and market consumer products.
5+ years of graphic design experience with a strong packaging portfolio; expertise in Adobe Creative Suite, packaging production, dielines, print specifications, file preparation, color theory, typography, layout, and brand systems.
Morristown or Swiftwater or Cambridge or Northborough
$71k-$103k/yrOnsiteFull Time
SanofiEuronext Paris: SAN: Researches, develops, and manufactures medicines and vaccines globally.
1+ YOEBachelor's in graphic design, 1+ years design experience, proficiency with artwork file management and MAC systems, ability to read packaging specifications and follow GMP/regulatory requirements.
Volantis Semiconductor: Private semiconductor startup building photonically integrated computers and photonic interconnects for AI inference and data-center systems.
Experience designing or developing processes for complex packages; first-principles problem solving. Preferred: heterogeneous materials, high-TDP packages, compound semiconductors, optics, interposers, flip-chip integration, or large substrates.
Sr. Packaging Engineer (TERADYNE, North Reading, MA)
North Reading, Massachusetts, United States
$175k-$281k/yrOnsiteFull Time
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
Master’s degree in electrical, packaging, or related engineering, or equivalent experience; extensive semiconductor package design and SI/PI experience; electromagnetic modeling, validation, supplier collaboration, and technical communication skills.
Dennis Group: A design-build engineering and general contracting firm that plans, designs, engineers, and builds food and beverage processing facilities.
8+ YOEBachelor's in engineering, 8+ years packaging/food & beverage experience, led packaging system installations, proficiency with AutoCAD, Microsoft Office and Microsoft Project, strong communication and project management skills, 50%-70% travel.
CSL Behring: Global biotherapeutics leader driven by our promise to save lives.
5+ YOEBachelor's degree in engineering, life sciences, or related field; 5+ years in medical device, combination product, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, FMEA, Design Controls
BAE SystemsLSE: BA.: Global defense, aerospace, and security technology.
10+ YOEAssociate's degree in mechanical CAD design or related plus 10+ years related experience; ability to obtain Secret clearance; electro-mechanical packaging experience; proficiency with PTC Creo Parametric and Windchill; GD&T/ASME knowledge.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
WHOOP: Wearable technology developing health and fitness tracking devices.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
Barry-Wehmiller: Manufactures industrial machinery for packaging and paper processing.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.
CSLASX: CSL: Develops and manufactures biopharmaceutical products and vaccines.
5+ YOEBachelor’s degree in engineering or life sciences; 5+ years in medical devices, combination products, packaging, quality, or manufacturing; 2+ years in medical device R&D quality and design controls; knowledge of FDA, EU MDR, ISO 13485, and ISO 14971.
21 CFR Part 4, 21 CFR 820, ISO 13485, ISO 14971, EU MDR, FMEA
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Helen of TroyNASDAQ: HELE: Designs and markets branded consumer housewares and personal care products.
15+ YOEBFA in Graphic Design or equivalent experience, 15+ years in graphic and package design, expert Adobe Creative Suite knowledge, team leadership experience, and US work authorization.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Maineline: Designs, fabricates, and installs custom signage for multifamily properties.
1+ YOERequires CorelDRAW, Adobe Acrobat, Microsoft 365, design and production-file skills, and strong communication. Bachelor's in graphic design or equivalent and 1–2 years of relevant experience preferred.
CorelDRAW, Adobe Acrobat, Microsoft 365, Zoho Projects
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOE5+ years in industrial engineering with Lean/Toyota Production System; Bachelor's in Engineering; experience with MHE/packaging lines; operating system/framework development; cross-functional collaboration.
Lean Manufacturing, Industrial IoT, Manufacturing Execution Systems (MES), Digital Lean Tools
Austin or Boxborough or Fishkill or Fort Collins or Longmont or Secaucus
HybridInternship, Temporary
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Currently enrolled in a US bachelor's program in engineering or a related field; knowledge of circuits, package or PCB design, Perl, Python, SQL, semiconductor packaging, or data analytics is encouraged.