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61 packaging developer jobs at 27 companies in Austin, TX

4w
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Packaging Engineer I
Austin, Texas, United States
OnsiteFull Time
YETI
YETINYSE: YETI: Sells premium outdoor gear, coolers, and drinkware.
2+ YOEBachelor's degree preferred, 2+ years packaging engineering experience, familiarity with ISTA/ASTM testing, packaging software (TOPS, MaxLoad Pro), PLM systems, and strong communication and project management skills.
TOPS, MaxLoad Pro, Product Lifecycle Management (PLM)
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2w
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Junior Software Packaging Engineer
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yr HybridFull Time
NinjaOne
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
Java, Kotlin, C++, Golang, Postgres, AWS, Git, PowerShell, Zsh, CI/CD, Copilot, Claude
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2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
Microsoft
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
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3mo
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IC Packaging Simulation Engineer
Austin or San Francisco
HybridFull Time
Apple
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS with 10+ years of relevant experience; strong FEM experience (ANSYS/ABAQUS); MATLAB and/or Python; Gen-AI/ML; knowledge of packaging materials and electronic packaging.
ANSYS, ABAQUS, HyperMesh, MATLAB, Python, Generative AI tools
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3mo
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Silicon Packaging Process Engineer, Production (Starlink)
Bastrop, Texas, United States
OnsiteFull Time
SpaceX
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
1+ YOEBachelor’s in engineering/science; 1+ years in manufacturing; strong data skills; experience in packaging and semiconductor processes preferred.
JMP, SQL
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1mo
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Integrated Circuit Packaging Architect
Austin, Texas, United States
$142k-$244k/yr HybridFull Time
AMD
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Proven semiconductor technology development experience, leadership driving engineering teams, expertise in materials/thin film/process/packaging, experience with manufacturing partners and yield improvement; BS/MS/PhD in relevant field.
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1w
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Principal Battery/High Voltage/High Power Packaging Engineer
Endicott or Austin or Detroit or New York or Texas or Michigan
$107k-$183k/yr OnsiteFull Time
BAE Systems
BAE SystemsLondon Stock Exchange: BA: Provides advanced defense, aerospace, and security technology solutions.
8+ YOEBachelor’s in Mechanical Engineering,8+ years related experience,expertise in battery and high-voltage packaging,thermal/structural analysis,lightweight materials,manufacturing interface,and strong communication skills.
3D CAD
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3w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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1mo
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Director, Advanced Packaging Disruptive Technology (Based in Singapore)
Singapore or Santa Clara or Boise or Austin or Rehovot or Kirchheim bei München
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
15+ YOE15+ years in semiconductor technology with advanced packaging expertise; experience leading R&D/pathfinding teams; knowledge of D2W, RDL, CoWoS, TSV; ability to translate tech into business strategy and lead cross-functional programs.
D2W, RDL, CoWoS, TSV
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1mo
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Director, Advanced Packaging Disruptive Technology (Based in Singapore)
Santa Clara or Boise or Rehovot or Austin or Heimstetten or Singapore
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
15+ YOE15+ years in semiconductor technology with advanced packaging expertise (D2W, RDL, CoWoS, TSV), demonstrated innovation leadership, experience building and leading R&D teams, ability to translate technology to business strategy; willing to relocate to Singapore.
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2d
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
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2d
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
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2mo
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Package Development, Signal Integrity and Power Integrity Engineer, Senior Staff
Austin, Texas, United States
$143k-$211k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOESenior-level IC package development role requiring strong EM/PI fundamentals, high-speed packaging experience, and scripting automation.
Ansys HFSS, SI-Wave, Cadence Clarity, PowerSI, SIwave, Spectre, ADS, HSpice, MATLAB, Python
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1mo
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Staff Package Design Engineer
Austin or Tempe
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Cadence Allegro Package Designer, Siemens Xpedition Substrate Integrator
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1mo
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IWT Process Engineer
Austin, Texas, United States
$76k-$145k/yr OnsiteFull Time
Samsung Electronics
Samsung ElectronicsKorea Exchange: 005930: Develops and manufactures consumer electronics, semiconductors, and mobile devices.
2+ YOEB.S. in chemical or other engineering preferred; 2+ years engineering experience in water treatment; knowledge of water chemistry and unit processes; experience in industrial operations; ability to monitor, troubleshoot, and prepare work packages.
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1mo
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Application Engineer
Austin, Texas, United States
OnsiteFull Time
University Federal Credit Union
University Federal Credit Union: Provides banking and lending services to credit union members.
3+ YOE3+ years in desktop client engineering; hands-on Microsoft Intune and MECM; Windows 10/11 deployment, application packaging (MSI/MSIX/Win32), PowerShell scripting; familiarity with Azure AD/Entra ID, Conditional Access, and endpoint security; bachelor\u0002s degree or equivalent; bondable.
Microsoft Intune, Microsoft Endpoint Configuration Manager (MECM), Moysle, PowerShell, Azure AD, Entra ID, Conditional Access, Microsoft Defender, MSI, MSIX, Win32, Autopilot, Windows Update for Business, Windows 10, Windows 11
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1w
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BIM Engineer, Capacity Delivery
Austin, Texas, United States
$150k-$204k/yr OnsiteFull Time
Fluidstack
Fluidstack: Provides high-performance cloud GPU infrastructure for AI development.
Experience in BIM coordination for large MEP-heavy projects; production-fast in Revit and Navisworks; disciplined model/version management; clash detection and resolution; delivers coordinated drawings and prefab packages.
Revit, Navisworks, ACC, BIM 360, Dynamo
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1mo
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Senior Structural Engineer
Austin, Texas, United States
$115k/yr OnsiteFull Time
Aalo Atomics
Aalo Atomics: Developing mass-manufactured small modular nuclear reactors for clean energy.
8+ YOEBS in civil/structural engineering required (MS/PhD preferred), 8+ years structural experience (4+ years in nuclear or safety-critical preferred), PE (or pursuing) in a US jurisdiction, proficiency with major FEA packages, knowledge of relevant codes and DOE/NRC documentation.
ANSYS, ABAQUS, SAP2000, Jama Connect, Teamcenter
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1d
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Package Thermal & Mechanical Simulation Engineer
Austin, Texas, United States
HybridFull Time
NXP Semiconductors
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
Master's or PhD in Mechanical Engineering, experience with finite element modelling (preferably Ansys or Marc Mentat), understanding of semiconductor packaging, fluent English, onsite presence ≥3 days/week.
Ansys, Marc Mentat
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1mo
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Mechanical Engineer, Staff to Principal level
Austin, Texas, United States
$110k-$183k/yr OnsiteFull Time
Enphase Energy
Enphase EnergyNASDAQ: ENPH: Manufacturer of microinverter-based solar and energy storage systems.
8+ YOEExperienced mechanical design engineer for high-power electrical equipment; strong busbar, wire-harness, board-packaging, insulation coordination, manufacturability, FEA/CFD, and SolidWorks skills; mentoring experience.
SolidWorks, FEA, CFD, CNC
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