Gates Industrial CorporationNYSE: GTES: Manufacturer of power transmission and fluid power solutions.
5+ YOEBachelor's in engineering, 5+ years packaging engineering or manufacturing experience, AutoCAD proficiency, BOM and change control experience, familiarity with Prop 65/EU packaging rules, Lean/Six Sigma knowledge, up to 20% travel, must be authorized to work in the U.S.
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yrHybridFull Time
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
Quantinuum: Building full-stack quantum computing hardware and software systems.
Advanced semiconductor/photonic packaging expert with significant senior-level experience (12+ years with PhD, 15+ with MS, or 18+ with BS). Must be a U.S. Person and meet national security nationality restrictions.
Lockheed MartinNYSE: LMT: Designs and manufactures global security and aerospace systems.
3+ YOEBachelor's in Mechanical Engineering or equivalent experience, 3+ years professional experience, electro-mechanical packaging and GD&T experience, CREO/Pro-E/CAD knowledge, ability to obtain and maintain DoD Secret clearance (US citizenship required).
CREO, Pro-E, Zuken, Microsoft Word, Microsoft Excel, Microsoft Project, Microsoft PowerPoint
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEBachelor's or equivalent, 4+ years Linux system-level software development, experience with package management, repository and release automation, Python or Bash scripting, CI/CD and kernel/driver familiarity.
Janus HendersonNYSE: JHG: Provides global asset management and investment advisory services.
Expert in Windows Installer; SCCM: application configuration and deployment; experience in a locked-down global enterprise; strong teamwork, communication, and problem-solving; able to operate in high-pressure environments.
Windows Installer, Microsoft Endpoint Configuration Manager, PowerShell, VBScript
Sr. Internal Harnessing and Packaging Engineer – BNS Core Components
Longmont or Denver
$144k-$202k/yrOnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
8+ YOEBS in engineering,8+ years in electronics packaging or harnessing,product transition to high-rate production,DfM/DfA,IPC/WHMA-A-620 knowledge,proficiency with Creo/SolidWorks/Altium/Windchill,U.S. work eligibility required.
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
4+ YOEBachelor's or equivalent,4+ years software development with Linux system-level focus, experience with package managers and repositories, scripting in Python or Bash, strong debugging and collaboration skills.
Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yrHybridFull Time
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
MoogNYSE: MOG.A: Design and manufacture of precision motion control systems.
5+ YOEBachelor's in Mechanical Engineering or related, 5+ years designing/testing CCAs, cabling, and enclosures; ability to obtain U.S. security clearance; proficiency with NX, Teamcenter, and ANSYS Workbench; strong communication and customer interface skills.
Electrical Engineer — Signal Distribution & Controls Packaging
Denver, Colorado, United States
$125k-$150k/yrOnsiteFull Time
Xcimer Energy: Developing laser-driven inertial fusion for commercial clean energy
Bachelor’s degree in Electrical Engineering; experience owning electrical system design; strong background in power distribution, protection, grounding, and electrical safety; experience designing control panels and creating P&IDs
Associate Engineer, Product Innovation - Metal Packaging Laboratories
Westminster, Colorado, United States
$67k-$93k/yrOnsiteFull Time
Ball CorporationNYSE: BALL: Produces sustainable aluminum packaging for beverages and household products.
0+ YOEBachelor's in engineering or 0–2 years engineering experience (or 3 years related experience), metrology and data analysis skills, technical writing, and ability to execute test plans and root cause analysis.