156 packaging developer jobs at 51 companies in Hollister, CA
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Sr Packaging Engineer
Santa Clara, California, United States
$134k-$184k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
8+ YOE8+ years in medical device packaging design; BS in Packaging/Mechanical/Industrial Engineering; experience with thermoforming, pouch sealing, ISO11607, CFR 820; CAD (SolidWorks); travel; strong communication.
SolidWorks, FEA, Packaging testing tools, MS Office
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOE12+ years IC packaging development/NPI experience; degree in materials/mechanical/electrical/physics or equivalent; deep packaging expertise; familiarity with FA tooling and EDA/FEM tools.
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
Flexible Packaging Engineer - Destiny Packaging |Salinas, CA
Salinas, California, United States
$75k-$80k/yrHybridFull Time
BunzlLondon Stock Exchange: BNZL: Global distributor of essential non-food consumables and services.
Knowledge of flexible packaging films and structures, Excel and presentation skills, ability to support sales and customers, bachelor's degree preferred, travel as needed; 2 years field experience preferred.
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Proven semiconductor technology development and leadership experience in package architecture, process definition, DFM/DFY, and yield improvement; strong communication skills; BS/MS/PhD in related fields.
Avicena: Develops microLED optical interconnects for high-speed chip-to-chip communication.
5+ YOEMS/PhD in engineering or materials science,5+ years semiconductor packaging experience with TSV reveal and C4 bumping,DOE/SPC and metrology expertise,experience with OSATs and HVM ramping.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
Johnson & JohnsonNYSE: JNJ: Global healthcare providing pharmaceuticals and medical technologies.
6+ YOEBachelor's degree, 6+ years packaging engineering experience with large capital systems, proficiency with SolidWorks and PLM, knowledge of ASTM/ISTA/ISO testing and medical device regulatory requirements.
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
1+ YOEBachelor's degree in engineering/physics/materials, 1+ years semiconductor/packaging or photonics experience, hands-on optical alignment and fiber optics knowledge, data analysis (Excel/JMP/MATLAB/Python), SPC/DOE familiarity, strong problem-solving and collaboration skills.
Johnson & JohnsonNYSE: JNJ: Provides pharmaceutical products and medical technology healthcare solutions.
6+ YOESix years of packaging engineering experience; CAD/PLM proficiency; knowledge of FDA/QSR and ISO standards; experience with packaging validation and testing for medical devices.