54 packaging developer jobs at 24 companies in Lynnwood, WA
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Senior Packaging Engineer
Seattle, Washington, United States
$120k-$140k/yrHybridFull Time
Stanley 1913: Manufacturer of reusable vacuum-insulated drinkware and food containers.
6+ YOERequires 6+ years as a packaging engineer, bachelor's degree in packaging engineering or related technical field or equivalent experience, Artios and Adobe Creative Suite proficiency, and packaging materials and manufacturing knowledge.
PhilipsEuronext Amsterdam: PHIA: Manufactures medical imaging systems and personal care appliances.
3+ YOE3+ years designing paperboard, corrugate, thermoformed and pulp tray packaging; Bachelor’s in Engineering or equivalent; experience with ArtiosCAD, CAPE Pack, Adobe Illustrator, Solidworks/CREO; knowledge of packaging testing, sustainability, and logistics.
Helion: Building fusion reactors to produce clean, low-cost electricity.
Hands-on experience in power electronics packaging for high-current/high-voltage applications, strong thermal engineering and modeling skills, experience with SCRs/diodes, and proven ability to translate research into hardware.
Software Development Engineer II, Robotics Development and Packaging Innovation
Bellevue, Washington, United States
$144k-$194k/yrOnsiteFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
3+ YOE3+ years professional software development, 2+ years system design/architecture, experience building large-scale distributed systems, proficiency with C#, C++, Java, or Perl, bachelor's degree in CS/Engineering/Mathematics or related.
Blue Origin: Develops reusable rockets and systems for human spaceflight.
7+ YOEBachelor's in Mechanical/Aerospace Engineering,7+ years designing ruggedized electronic enclosures/avionics packaging,structural and thermal analysis experience,Creo/Ansys proficiency,experience through qualification and production,US work-authorization required.
StarbucksNasdaq: SBUX: Operates a global chain of coffeehouses and roastery reserves.
Lead end-to-end packaging product and innovation strategy, develop briefs, guide R&D and testing, commercialize solutions, and influence cross-functional partners; Bachelor's degree or equivalent; MBA preferred.
Anduril Industries: Defense technology building autonomous military hardware and software.
15+ YOERequires 15+ years building automated verification suites, 5+ years with NixOS, declarative package management, and virtualization; embedded systems experience and technical leadership. Bachelor's degree or equivalent preferred.
Nix, NixOS, C++, AWS, Microsoft Azure, Google Cloud Platform (GCP), Docker, Kubernetes, Jetpack, Lattice, HITL
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEExperience in semiconductor IC development, manufacturing, testing and packaging; doctorate/masters/bachelor degree with corresponding years of engineering experience; security screening and export-control eligibility required.
Gravitics: Designs and manufactures large-scale orbital space structures.
5+ YOEBachelor’s in Electrical Engineering; 5+ years in power converter or electrical power system development; design/testing 1-10 kW power systems; space-environment packaging; strong collaboration skills.
Senior Systems Software Engineer, Kubernetes Node Lifecycle - DGX Cloud
Santa Clara or Seattle
$184k-$357k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
8+ YOE8+ years systems software/cloud infrastructure/Kubernetes node engineering experience. Expertise in Cluster API, OS image build pipelines and packaging, nodepool lifecycle, kubelet configuration, node image security, Golang/Python, and public cloud (GCP/AWS/Azure/OCI).
(C) Project Engineer II – NAVSEA Ship Repair & Modernization
Seattle, Washington, United States
$120k-$150k/yrFieldFull Time
TMMG: Provides engineering and life cycle management for naval fleets.
3+ YOEProvide technical leadership for NAVSEA ship repair and modernization, interpret contract/NAVSEA requirements, develop engineering packages, and support production with 3+ years ship/industrial experience.
AutoCAD, Bluebeam, Microsoft Office Suite, Microsoft Project
HitachiTokyo Stock Exchange: 6501: Global provider of digital systems and social infrastructure solutions.
Experience managing enterprise endpoints with Intune and SCCM/MECM, Windows SOE image engineering, software packaging/deployment, AD/GPO administration, JAMF Pro, PowerShell, troubleshooting, and ITSM.
Microsoft Intune, SCCM, MECM, JAMF Pro, PowerShell, Active Directory, Group Policy, ITSM
San Diego or District of Columbia or Jacksonville or Honolulu or Pearl Harbor or Norfolk County or Silverdale
$106k-$158k/yrOnsiteFull Time
Department of the Navy: Operates and maintains combat-ready naval and marine forces.
1+ YOELead and review facilities mechanical engineering design packages, provide SME recommendations on design submittals, and consult on mechanical design during construction; professional engineering degree or EI/EIT/PE or FE acceptable.
Crane CompanyNYSE: CR: Manufactures engineered components for aerospace and industrial process markets.
8+ YOEBA/BS in engineering required (Master's/PhD preferred), 8+ years relevant experience, knowledge of mechanics, heat transfer, vibration, and electronics packaging, proficiency with Autodesk Inventor, mentoring experience, and ability to perform analyses and testing.
magniX: Designs and manufactures electric propulsion systems for sustainable aircraft.
5+ YOEBachelor's in mechanical engineering or related field,5+ years in thermal management and mechanical packaging of power electronics/battery systems,experience with air and liquid cooling and enclosure design,familiarity with datacenter rack standards.
RTXNYSE: RTX: Provides advanced aerospace and defense systems and services.
2+ YOEBachelor's in STEM and minimum 2 years experience, experience with AS9100/AS9102, technical data package review, RCA and corrective actions, ability to obtain and maintain DoD Secret clearance; U.S. citizenship required.
AS9102, APQP/AS9145, Production Part Approval Process (PPAP), DFMEA, PFMEA, Common Product Data Management (cPDM), Common As-Built System (CABS), 5S, Lean Six Sigma (6Sigma)
ImpinjNASDAQ: PI: Provides RAIN RFID technology for tracking and identifying items.
5+ YOEBachelor's in engineering/physics, 5+ years semiconductor process experience including backend/WLCSP/packaging, failure analysis using SEM/TEM/FIB/ion milling/AFM, DOE/SPC/yield analysis, JMP/Minitab/Python/MATLAB, Lean Six Sigma/8D, occasional international travel.
SEM, TEM, FIB, ion milling, AFM, JMP, Minitab, Python, MATLAB
Sr. Reliability Engineer, Power Modules and AI Applications
San Jose or Kirkland
$115k-$170k/yrOnsiteFull Time
Monolithic Power SystemsNasdaq: MPWR: Provides energy-efficient integrated power semiconductor solutions for electronics.
5+ YOE5+ years in reliability testing/qualification of IC devices and packages; MSc/PhD in materials/EE/physics/mechanical; JMP/Weibull; SEM/CSAM/X-ray/OBIRCH/TIVA; AI data center power architectures a plus.
JMP, Reliasoft, SEM, CSAM, X-ray, OBIRCH/TIVA, Weibull