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74 packaging developer jobs at 40 companies in Manteca, CA

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Packaging Engineer
San Ramon, California, United States
$84k-$105k/yr HybridFull Time
Rodan + Fields
Rodan + Fields: Develops and sells dermatology-inspired skincare and haircare products.
3+ YOEBachelor's in package or related engineering, 3+ years package development experience, strong technical drawing review, project management, analytical, leadership, and communication skills.
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Memory Packaging Engineer
San Jose or San Diego
$180k-$272k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
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2mo
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Packaging Engineer III
Foster City, California, United States
$118k-$153k/yr OnsiteFull Time
Gilead Sciences
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
5+ YOEBachelor’s or Master’s in Packaging/Engineering with 5+ years in pharma packaging; knowledge of cGMP; willingness to travel up to 20%.
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Sr. Packaging Engineer
Fremont, California, United States
OnsiteFull Time
Nextracker
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Power BI, Excel, SolidWorks, CATIA
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Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
Analog Devices
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
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Packaging Design Engineer I
San Jose or Hayward or Texas
OnsiteFull Time
TransPak: Packaging solutions provider
2+ YOEBachelor’s in mechanical/manufacturing/industrial/packaging engineering; 2-3 years mechanical/structural design experience; CAD (SolidWorks/AutoCAD); GD&T knowledge; packaging design and testing experience; strong communication.
SolidWorks, AutoCAD, NX, BOM, 3D modeling, 2D drawings, GD&T
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Senior IC Packaging Engineer
San Jose, California, United States
OnsiteFull Time
Axiado
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
Cadence Allegro Package Designer (APD), HFSS, SIwave, Ansys Designer, Flip-Chip BGA, SiP, RDL, UCIe, PCIe, LPDDR5, LPDDR5X
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Photonic Packaging Engineer, Principal
San Jose, California, United States
OnsiteFull Time
Astera Labs
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
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Associate Optical Packaging Engineer
Milpitas, California, United States
$115k-$130k/yr OnsiteFull Time
PsiQuantum
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
1+ YOEBachelor's degree in engineering/physics/materials, 1+ years semiconductor/packaging or photonics experience, hands-on optical alignment and fiber optics knowledge, data analysis (Excel/JMP/MATLAB/Python), SPC/DOE familiarity, strong problem-solving and collaboration skills.
Microsoft Excel, JMP, MATLAB, Python
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Staff Engineer, Packaging Mechanical Simulation
San Jose, California, United States
$163k-$253k/yr OnsiteFull Time
Samsung Semiconductor
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
3+ YOEPhD in engineering discipline, 3+ years modeling/simulation experience in semiconductors, expertise in mechanical/thermal modeling, strong technical writing and collaboration skills.
ANSYS, Abaqus, HyperMesh, Python, MATLAB, ANSYS APDL
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R&D Packaging Scientist 1 (Recent Grad Starting in 2026)
Pleasanton, California, United States
HybridFull Time
Clorox
CloroxNew York Stock Exchange: CLX: Manufactures and markets consumer cleaning and wellness products.
Recent graduate (Dec 2025–Aug 2026) with a 3.0+ GPA in packaging, materials, or mechanical engineering; knowledge of ASTM testing; experience with ArtiosCAD and TOPS; able to work in a lab and prototype samples.
ArtiosCAD, TOPS
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ASIC Packaging Signal/Power Integrity Engineer (Hybrid)
San Jose, California, United States
$153k-$219k/yr OnsiteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
0+ YOEDegree in Electrical Engineering (BS/MS/PhD) with relevant SI/PI experience; expertise in high-speed signaling, SI/PI simulation and layout review using industry EDA tools; strong communication and technical problem-solving skills.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, IBIS, Vector Network Analysis
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Staff Software Engineer, Pricing and Packaging Engineering
San Francisco or Denver or New York City or San Jose
$197k-$247k/yr HybridFull Time
Gusto
Gusto: Cloud-based payroll and HR software for small businesses.
8+ YOE8+ years building large-scale backend platform systems (commerce/billing/subscriptions preferred); strong distributed systems, API design, SLO, and mentorship experience; proven delivery of multi-quarter projects.
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Staff Engineer, Build & Toolchain Infrastructure
San Jose, California, United States
$172k-$258k/yr OnsiteFull Time
ASML
ASMLNASDAQ: ASML: Manufactures lithography systems used to print patterns on wafers.
6+ YOELead build/toolchain architecture for reproducible builds, hermetic environments, packaging, and developer productivity; 6+ years Linux distributed systems; bachelor’s in CS/engineering.
Linux, Build systems, Toolchains, Packaging, Artifact management
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3mo
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Engineer II, Manufacturing Engineering
Fremont, California, United States
$79k-$106k/yr OnsiteFull Time
Thermo Fisher Scientific
Thermo Fisher ScientificNYSE: TMO: Sells equipment and chemicals for scientific research and healthcare.
2+ YOEB.S. in engineering with 2-5 years of experience; GMP exposure; labeling/packaging equipment knowledge; PLC/HMI programming and design software useful; must be legally authorized to work in the U.S. without sponsorship.
Zebra printers, CIvision systems, Packaging equipment, Labeling equipment
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2mo
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Manufacturing Engineer
Fremont, California, United States
$94k-$130k/yr OnsiteFull Time
Amphenol Advanced Sensors
Amphenol Advanced SensorsNYSE: APH: Designs and manufactures advanced sensing and measurement technologies.
3+ YOEBS in Materials/Electrical/Mechanical Engineering; 3+ years in semiconductor or sensor packaging/process development; 2+ years hands-on packaging/assembly; experience with die attach, wire bonding, flip-chip, molding/encapsulation, soldering, failure analysis; strong DOE and statistical skills; experience documenting processes and PPAP/APQP for aut...
Minitab, JMP, Excel, Wire bonders, Flip-chip bonders, Die bonders, Reflow ovens, Mold presses, Plasma cleaning tools, Pick-and-place, X-ray/CT, SEM, C-SAM, Environmental chambers
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Senior Package Design Engineer
San Jose or Taipei
$111k-$206k/yr HybridFull Time
Rambus
RambusNASDAQ: RMBS: Develops high-performance memory interface chips and semiconductor IP.
5+ YOEMS in EE/CE, 5+ years packaging design/layout experience, proficiency with Cadence Allegro Package Designer (APD) and AutoCAD, experience with multiple package types and high-speed routing, knowledge of substrate technologies and JEDEC standards.
Cadence Allegro Package Designer (APD), AutoCAD
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Principal Package Design Engineer
San Jose, California, United States
$195k-$240k/yr HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
5+ YOEMSc/PhD in engineering, 5+ years semiconductor packaging experience, expertise in advanced packaging architectures, reliability testing, thermal/mechanical/electrical analysis, OSAT collaboration, and project leadership.
Cadence Allegro Package Designer, Solid works, ANSYS, COMSOL, JMP, Minitab
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3mo
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Senior Staff Product Engineer
San Jose, California, United States
$159k-$229k/yr OnsiteFull Time
Power Integrations
Power IntegrationsNASDAQ: POWI: Produces high-voltage integrated circuits for efficient power conversion.
12+ YOELead in product development; analyze data for yield and qualification; mentor team; strong background in analog/CMOS/GaN packaging.
GaN, LDMOS, Analog circuitry, Failure analysis, Data analysis, Matlab, Jira, Confluence, AI tools
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R&D Process Engineer, Advanced Bonding Process Development
San Jose or California
$125k-$145k/yr OnsiteFull Time
Diamond Foundry
Diamond Foundry: Produces sustainable diamond wafers for semiconductors and jewelry.
Bachelor's degree in materials science, electrical or chemical engineering (or advanced degree), experience in semiconductor packaging or process engineering preferred, familiarity with bonding, thin-film deposition, surface preparation, metrology, failure analysis, reliability testing, strong problem-solving and communication skills.
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