60 packaging developer jobs at 39 companies in Oceanside, CA
1mo
Save
Mark Applied
Hide
1mo
Packaging Engineer, Sentry
Irvine, California, United States
$129k-$171k/yrOnsiteFull Time
Anduril Industries: Defense technology building autonomous military hardware and software.
5+ YOEBachelor's degree in a technical field, 5+ years packaging engineering experience for electronic/electromechanical products, ability to design and validate protective packaging, knowledge of ASTM/ISTA/MIL-STD, CAD proficiency (SolidWorks/NX), must be a U.S. Person.
SolidWorks, NX, Siemens NX, JIRA, Teamcenter, Oracle, PDM/PLM, MES
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
5+ YOEBachelor in engineering, physics or chemistry; 5+ years electronics packaging experience (3 with MS); package assembly and manufacturing process development; AutoCAD and Cadence Allegro experience; DOE and supplier collaboration experience.
Westpak: A testing that provides package and product testing services and invests in employee ownership and development.
B.S. in packaging, mechanical, industrial engineering or equivalent; 2-5 years lab/package testing preferred; ability to follow ASTM/ISTA protocols, interpret data, and use Microsoft Office.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in engineering plus 4+ years (or MS+3 or PhD+2) in system/package design or technology engineering; expertise in advanced IC packaging (FCCSP, FCBGA, SiP, RDL, 2.5D/3D), NPI, reliability testing, FMEA/SPC, and cross-functional collaboration.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
5+ YOEBachelor's in Engineering with 5+ years or Master's with 3+ years; experience in advanced packaging design, GDSII layout, and 2.5D/3D packaging; MCM layout a plus.
Skyworks SolutionsNASDAQ: SWKS: Designs and manufactures analog and mixed-signal semiconductor solutions.
5+ YOEBachelor's degree in engineering or materials science, 5+ years experience in semiconductor packaging, expertise in failure analysis, material interaction, yield improvement, SPC/FMEA/Six Sigma knowledge, strong communication and problem-solving skills.
Blue Origin: Develops reusable rockets and systems for human spaceflight.
12+ YOELead IC packaging team; manage end-to-end package development for RF/mmWave AiP and complex SoCs; perform EM, SI, and thermal simulations; collaborate with IC designers and OSATs.
HerbalifeNYSE: HLF: A global nutrition selling weight management and dietary supplements.
4+ YOE4+ years packaging engineering experience, NPD and product launch experience, knowledge of plastics, corrugated and labels, attention to detail, sustainability understanding, strong time management.
Corona or Los Angeles or Orange County or Riverside County or San Diego
$114k-$152k/yrHybridFull Time
Monster EnergyNASDAQ: MNST: Developer and marketer of energy drinks and beverages.
3+ YOELead end-to-end packaging development for secondary packaging; manage cross-functional projects; develop packaging; plan print trials; ensure quality and efficiency.
General Atomics Aeronautical Systems: Designs and manufactures unmanned aircraft and radar systems.
4+ YOEBachelor's/masters/PhD in engineering or related field with supervisory experience; 4+ years (PhD) to 9+ years (BS) engineering experience, familiarity with military electronic packaging, DO-160/MIL-STD-810, and ability to obtain DoD clearance.
Photonics Process Development Engineer 2 Packaging and Tooling
San Diego, California, United States
$85k-$125k/yrOnsiteFull Time
Monarch Quantum: Building integrated photonics systems for quantum computing and sensing.
8+ YOEBS/MS in engineering or physics; typically 8+ years in photonics/optoelectronic process development with 5+ years owning manufacturing equipment (die bonders, wire bonders, vacuum reflow, active alignment, laser welding). U.S. person required; experience with SPC, DOE, reliability testing, and fixture/tooling design.
Vacuum reflow soldering, Wire bonding, Die bonding, Active alignment, Laser welding, Fiber splicing, Vision systems, Interferometry, DOE, SPC, FMEA
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Synchron: Developing implantable brain-computer interfaces to restore functional independence.
5+ YOEDesign and develop implantable mechanical systems; 5+ years in miniaturized, high-relIability electromechanical design; hermetic packaging; CAD; GD&T; production readiness.
Turion Space: Builds spacecraft for orbital debris removal and satellite servicing.
3+ YOEBachelor's degree, 3+ years software experience (developers with <3 may apply with strong projects). Proficiency in C++, Python, CMake, MATLAB, Fortran, package managers (Conan), Git/GitLab; experience with CI/CD and build/test pipelines; U.S. citizenship or other ITAR-eligible status.
Mach Industries: Designs and manufactures autonomous unmanned aerial vehicles for defense.
2+ YOE2+ years mechanical engineering experience with avionics integration or electronics packaging; Bachelor's degree required; hands-on hardware development; experience with 3D CAD (NX or SolidWorks), EMI/EMC mitigation, and wire harness design.
HenkelXETRA: HEN3: Manufactures laundry, beauty, and adhesive products globally.
12+ YOEBachelor's in materials/chemical/mechanical engineering,12+ years semiconductor packaging experience,people manager experience,knowledge of 2.5D/3D packaging trends,strong communication,project management,able to travel up to 10%.