44 packaging developer jobs at 29 companies in Solana Beach, CA
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Advanced Packaging Engineer
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
5+ YOEBachelor in engineering, physics or chemistry; 5+ years electronics packaging experience (3 with MS); package assembly and manufacturing process development; AutoCAD and Cadence Allegro experience; DOE and supplier collaboration experience.
Westpak: A testing that provides package and product testing services and invests in employee ownership and development.
B.S. in packaging, mechanical, industrial engineering or equivalent; 2-5 years lab/package testing preferred; ability to follow ASTM/ISTA protocols, interpret data, and use Microsoft Office.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in engineering plus 4+ years (or MS+3 or PhD+2) in system/package design or technology engineering; expertise in advanced IC packaging (FCCSP, FCBGA, SiP, RDL, 2.5D/3D), NPI, reliability testing, FMEA/SPC, and cross-functional collaboration.
Blue Origin: Develops reusable rockets and systems for human spaceflight.
12+ YOELead IC packaging team; manage end-to-end package development for RF/mmWave AiP and complex SoCs; perform EM, SI, and thermal simulations; collaborate with IC designers and OSATs.
Corona or Los Angeles or Orange County or Riverside County or San Diego
$114k-$152k/yrHybridFull Time
Monster EnergyNASDAQ: MNST: Developer and marketer of energy drinks and beverages.
3+ YOELead end-to-end packaging development for secondary packaging; manage cross-functional projects; develop packaging; plan print trials; ensure quality and efficiency.
General Atomics Aeronautical Systems: Designs and manufactures unmanned aircraft and radar systems.
4+ YOEBachelor's/masters/PhD in engineering or related field with supervisory experience; 4+ years (PhD) to 9+ years (BS) engineering experience, familiarity with military electronic packaging, DO-160/MIL-STD-810, and ability to obtain DoD clearance.
Photonics Process Development Engineer 2 Packaging and Tooling
San Diego, California, United States
$85k-$125k/yrOnsiteFull Time
Monarch Quantum: Building integrated photonics systems for quantum computing and sensing.
8+ YOEBS/MS in engineering or physics; typically 8+ years in photonics/optoelectronic process development with 5+ years owning manufacturing equipment (die bonders, wire bonders, vacuum reflow, active alignment, laser welding). U.S. person required; experience with SPC, DOE, reliability testing, and fixture/tooling design.
Vacuum reflow soldering, Wire bonding, Die bonding, Active alignment, Laser welding, Fiber splicing, Vision systems, Interferometry, DOE, SPC, FMEA
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Synchron: Developing implantable brain-computer interfaces to restore functional independence.
5+ YOEDesign and develop implantable mechanical systems; 5+ years in miniaturized, high-relIability electromechanical design; hermetic packaging; CAD; GD&T; production readiness.
Solar TurbinesNYSE: CAT: Manufacturer of industrial gas turbines and turbomachinery systems.
5+ YOEDesign and develop hydromechanical systems for industrial gas turbine packages; 5+ years engineering experience; Bachelor’s degree in mechanical engineering; P&ID reading; Promis-E/Creo experience.
San Diego or District of Columbia or Jacksonville or Honolulu or Pearl Harbor or Norfolk County or Silverdale
$106k-$158k/yrOnsiteFull Time
Department of the Navy: Operates and maintains combat-ready naval and marine forces.
1+ YOELead and review facilities mechanical engineering design packages, provide SME recommendations on design submittals, and consult on mechanical design during construction; professional engineering degree or EI/EIT/PE or FE acceptable.
Innoflight: Designs and manufactures compact cyber-secure avionics for space missions.
7+ YOEBachelor's in mechanical engineering (Master's preferred), 7+ years in aerospace electronic packaging, SolidWorks and FEA experience, knowledge of MIL/NASA/GEVS standards, active U.S. security clearance, and Microsoft Office proficiency.
SolidWorks, SolidWorks Simulation, NASTRAN, ANSYS, FEA, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Visio
ViasatNASDAQ: VSAT: Provider of global satellite-based connectivity and secure communication solutions.
5+ YOE5+ years mechanical design experience with electronics packaging, SolidWorks, thermal analysis to junction level, ruggedized product design, BS in Mechanical Engineering, U.S. citizenship, ability to obtain U.S. Secret Clearance.
SolidWorks, Ansys, Thermal Desktop, SolidWorks Flow Sim, Microsoft Word, Microsoft Excel, Microsoft PowerPoint
Fuse Integration: Developing tactical communication and networking systems for defense.
4+ YOE4+ years Linux/DevSecOps experience, deep low-level Linux skills (initramfs, SELinux), virtualization (KVM/libvirt), PXE/Kickstart, package management, security exposure (CVEs/STIGs), ability to obtain US Secret clearance, US citizenship.
Regional Sales Manager - Food Processing & Packaging Equipment – West Region
Clark County or Arizona or San Diego or Riverside County or San Bernardino County
FieldFull Time
MULTIVAC: Manufactures integrated packaging and food processing automation systems.
5+ YOEConsultative capital equipment sales experience (ideally 5+ years selling large packaging/processing equipment to food facilities); bachelor's degree preferred; engineering/technical background a plus; ability to develop territory business plans and manage CRM-driven sales process.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
5+ YOEBachelor's degree required; strong background in signal and power integrity of memory interfaces; experience with SI/PI, lab validation, and product package/board design; Python proficiency.
VNA, TDR, Oscilloscope, Spectrum Analyzer, Python, EM Simulation Tools