88 packaging developer jobs at 57 companies in Somerville, MA
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Packaging Engineer
Uxbridge, Massachusetts, United States
$68k-$78k/yrFieldContract, Full Time
Adept Group: Providing packaging engineering and consulting services to global brands.
1+ YOEBachelor's degree in packaging or related engineering field, 1–5 years relevant experience, proficiency with Microsoft Excel and PowerPoint, packaging testing and standards knowledge, and ability to lead audits and supervise field teams.
6+ YOESenior packaging engineer with 6-9 years of packaging R&D/engineering experience; strong project leadership and cross-functional collaboration; FDA/cGMP in food industry; packaging materials and systems expertise.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
MannKindNASDAQ: MNKD: Develops inhaled therapeutic products for endocrine and lung diseases.
5+ YOEBS in Package Engineering with 7-10 years or MS with 5-7 years in pharmaceutical packaging; knowledge of cGMPs; packaging equipment and testing methods; strong organization and multitasking.
Tata Consultancy ServicesNational Stock Exchange of India: TCS: Global provider of IT services, consulting, and business solutions.
5+ YOEBachelor's degree, minimum 5 years medical device quality systems experience, knowledge of FDA/MDD/MDR GMP, PLM/ERP/SAP/Windchill experience, and experience leading cross-functional teams.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster's in engineering or related field required, 2 years packaging engineering experience, expertise with SolidWorks, ANSYS, and AutoCAD, IC package design and reliability, FMEA/PCN/SPC/DOE experience.
GPD Optoelectronics: Manufactures high-performance infrared photodetectors and custom optoelectronic sensors.
8+ YOEBS in engineering or materials, 8+ years semiconductor/photonics die packaging experience, expertise in packaging techniques, DOE and root-cause methods, ability to lead cross-functional teams.
Smith & NephewLondon Stock Exchange: SN: Develops medical equipment for tissue repair, regeneration, and replacement.
2+ YOEBachelor’s degree in Packaging Engineering or Packaging Science; 2+ years in packaging engineering for medical devices or regulated industries; knowledge of FDA, GMP, ISO; CAD tools with SolidWorks preferred.
CorningNYSE: GLW: Develops and manufactures specialty glass, ceramics, and optical fiber.
1+ YOEBachelor's in Packaging Science + 3 years packaging engineering experience (medical/pharma/life sciences) or Master's + 1-2 years. Experience with DOE, ASTM/ISTA testing, TOPS Pro or CAPE, SolidWorks, interpreting drawings, and packaging for automation. Up to 25% travel.
TOPS Pro, CAPE, SolidWorks, Design of Experiments (DOE), ASTM, ISTA
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEBachelor's or equivalent, 4+ years Linux system-level software development, experience with package management, repository and release automation, Python or Bash scripting, CI/CD and kernel/driver familiarity.
Johnson & JohnsonNYSE: JNJ: Global healthcare providing pharmaceuticals and medical technologies.
8+ YOE8+ years packaging or related supply chain experience in regulated industries, packaging engineering and supplier management experience, knowledge of sterile packaging and validation, ISO standards familiarity, strong financial and leadership skills.
Ringaskiddy or Zuchwil or Raynham or Raritan or Palm Beach Gardens or Warsaw
OnsiteFull Time
Johnson & JohnsonNYSE: JNJ: Provides pharmaceutical products and medical technology healthcare solutions.
8+ YOE8+ years packaging/engineering experience in regulated industry preferred; people management and project leadership; knowledge of sterile packaging, validations, ISO13485/11607, ISTA/ASTM; strong financial acumen and Microsoft Office proficiency.
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
4+ YOEBachelor's or equivalent,4+ years software development with Linux system-level focus, experience with package managers and repositories, scripting in Python or Bash, strong debugging and collaboration skills.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Infinidat: Provider of high-performance enterprise storage and data protection solutions.
7+ YOE7+ years Python systems/CLI development, enterprise storage experience, strong Linux packaging and distribution skills, SSH/WinRM integration, container and CI/CD pipeline experience, and strong written communication.
Walleye Capital: Multi-strategy investment firm specializing in quantitative and volatility strategies.
Pursuing an undergraduate or advanced degree in CS, engineering, statistics, mathematics; strong coding skills; experience with ML packages; interest in quantitative trading.
Director, Project Development – Process & Packaging Systems
Alpharetta or Atlanta or Philadelphia or Fort Worth or Boston or St. Louis or Raleigh or Chicago
OnsiteFull Time
Barry-Wehmiller: Manufactures industrial machinery for packaging and paper processing.
15+ YOE15+ years leading development and design of process and packaging systems for manufacturing; bachelor's in engineering/science/manufacturing required; ability to lead GMP facility design, manage project budgets, lead pursuit teams, and travel for client engagements.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.