66 packaging engineer jobs at 39 companies in Carlsbad, CA
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Packaging Engineer, Sentry
Irvine, California, United States
$129k-$171k/yrOnsiteFull Time
Anduril Industries: Defense technology building autonomous military hardware and software.
5+ YOEBachelor's degree in a technical field, 5+ years packaging engineering experience for electronic/electromechanical products, ability to design and validate protective packaging, knowledge of ASTM/ISTA/MIL-STD, CAD proficiency (SolidWorks/NX), must be a U.S. Person.
SolidWorks, NX, Siemens NX, JIRA, Teamcenter, Oracle, PDM/PLM, MES
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
2+ YOEBachelor's in engineering plus 4+ years (or MS+3 or PhD+2) in system/package design or technology engineering; expertise in advanced IC packaging (FCCSP, FCBGA, SiP, RDL, 2.5D/3D), NPI, reliability testing, FMEA/SPC, and cross-functional collaboration.
5+ YOEBachelor in engineering, physics or chemistry; 5+ years electronics packaging experience (3 with MS); package assembly and manufacturing process development; AutoCAD and Cadence Allegro experience; DOE and supplier collaboration experience.
Edwards LifesciencesNYSE: EW: Designs and manufactures medical devices for structural heart disease.
2+ YOEBachelor's in engineering or scientific field, 2+ years engineering experience, experience with lab/industrial equipment, CAD and MS Office skills, project management and statistical familiarity.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Skyworks SolutionsNASDAQ: SWKS: Designs and manufactures analog and mixed-signal semiconductor solutions.
5+ YOEBachelor's degree in engineering or materials science, 5+ years experience in semiconductor packaging, expertise in failure analysis, material interaction, yield improvement, SPC/FMEA/Six Sigma knowledge, strong communication and problem-solving skills.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
4+ YOEMS or PhD in engineering/physics,4+ years advanced packaging industry experience,expertise in heterogeneous integration,hybrid bonding and high-density interconnects,collaboration with foundries and OSATs.
Westpak: A testing that provides package and product testing services and invests in employee ownership and development.
B.S. in packaging, mechanical, industrial engineering or equivalent; 2-5 years lab/package testing preferred; ability to follow ASTM/ISTA protocols, interpret data, and use Microsoft Office.
General Atomics Aeronautical Systems: Designs and manufactures unmanned aircraft and radar systems.
4+ YOEBachelor's/masters/PhD in engineering or related field with supervisory experience; 4+ years (PhD) to 9+ years (BS) engineering experience, familiarity with military electronic packaging, DO-160/MIL-STD-810, and ability to obtain DoD clearance.
HR MGMT 10: Provides employer of record and human resources support services.
2+ YOEHigh school diploma; 2+ years in packaging/production; cannabis/food/pharma background preferred; pass background; 21+; valid driver's license; lift up to 50 lbs; state cannabis certifications.
Electro-Mechanical Engineer II - Microelectronics Packaging
San Diego, California, United States
$76k-$144k/yrOnsiteFull Time
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
2+ YOEBachelor's in STEM and 2+ years mechanical/electronics packaging experience, ability to obtain DoD Secret clearance, PTC Creo and Windchill experience, mechanical design and GD&T knowledge.
PTC Creo Parametric, Windchill Product Data Management System
Senior Engineer, Oral Solid Dose Packaging Development
San Diego, California, United States
$97k-$133k/yrOnsiteFull Time
Neurocrine BiosciencesNASDAQ: NBIX: Develops pharmaceuticals for neurological, endocrine, and psychiatric disorders.
4+ YOEBachelor’s in a technical field with 4+ years (or Master’s with 2+ years) of pharmaceutical packaging development experience in a cGMP environment; knowledge of FDA/ICH guidance, ASTM/ISTA/ISO standards; strong technical judgment and cross-functional leadership.
Photonics Process Development Engineer 2 Packaging and Tooling
San Diego, California, United States
$85k-$125k/yrOnsiteFull Time
Monarch Quantum: Building integrated photonics systems for quantum computing and sensing.
8+ YOEBS/MS in engineering or physics; typically 8+ years in photonics/optoelectronic process development with 5+ years owning manufacturing equipment (die bonders, wire bonders, vacuum reflow, active alignment, laser welding). U.S. person required; experience with SPC, DOE, reliability testing, and fixture/tooling design.
Vacuum reflow soldering, Wire bonding, Die bonding, Active alignment, Laser welding, Fiber splicing, Vision systems, Interferometry, DOE, SPC, FMEA
HenkelXETRA: HEN3: Manufactures laundry, beauty, and adhesive products globally.
12+ YOEBachelor's in materials/chemical/mechanical engineering,12+ years semiconductor packaging experience,people manager experience,knowledge of 2.5D/3D packaging trends,strong communication,project management,able to travel up to 10%.
San Diego or District of Columbia or Jacksonville or Honolulu or Pearl Harbor or Norfolk County or Silverdale
$106k-$158k/yrOnsiteFull Time
Department of the Navy: Operates and maintains combat-ready naval and marine forces.
1+ YOELead and review facilities mechanical engineering design packages, provide SME recommendations on design submittals, and consult on mechanical design during construction; professional engineering degree or EI/EIT/PE or FE acceptable.