48 packaging engineer jobs at 34 companies in East Providence, RI
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Lead Packaging Engineer
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
Velaura AI: Developing ultra-low-power silicon and IP for AI accelerators.
Deep experience in advanced semiconductor package architecture, substrate/assembly technologies, package-level signal and power integrity, thermal and reliability considerations, and cross-functional system optimization.
MannKindNASDAQ: MNKD: Develops inhaled therapeutic products for endocrine and lung diseases.
5+ YOEBS in Package Engineering with 7-10 years or MS with 5-7 years in pharmaceutical packaging; knowledge of cGMPs; packaging equipment and testing methods; strong organization and multitasking.
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
5+ YOEBachelor's in Packaging, Mechanical, Biomedical Engineering or related field; 5–8 years packaging engineering in medical device/pharma; ISO 11607-1/2, ISO 13485, ISO 16975, ICH, ASTM/ISTA; DFSS, DOE; FEA; CAPE/TOPS/SolidWorks experience.
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
WHOOP: Wearable technology for personalized health and performance tracking.
5+ YOEBS or MS in mechanical or industrial design engineering; 5+ years developing packaging at scale; SolidWorks CAD and Adobe Illustrator proficiency; experience with suppliers, manufacturing, prototyping, drawings, BOMs, and ECOs.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Lightmatter: Develops photonic processors and interconnects for AI data centers
5+ YOESenior thermal engineer with MS/PhD in engineering and 5+ years in package/system thermal analysis; expertise in conduction, convection, CFD; experience with advanced cooling tech; proficient in ANSYS tools; lab validation.
Arlington or Boston or Austin or Nashville or Bellevue or Arlington or New York or San Francisco or Irving or Houston
HybridFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
4+ YOEBachelor's in industrial/manufacturing engineering; 4+ years in industrial/operations engineering; experience with material handling equipment; knowledge of automated material handling systems, packaging and storage; intermediate AutoCAD, VBA, SQL.
AutoCAD, VBA, SQL, Microsoft Office, Visio, MS Project
G2 Ops: Provides digital engineering and cybersecurity solutions for defense organizations.
7+ YOEBachelor's in engineering/STEM,7+ years mechanical/systems/electromechanical/CAD experience,advanced SolidWorks and AutoCAD skills,experience with Technical Design Packages,knowledge of RF/antenna systems and configuration management,ability to obtain DoD Secret clearance.
Boston or Newark or New York or Chicago or Washington
$128k-$159k/yrHybridFull Time
Arup: Global professional services firm for the built environment.
8+ YOEBachelor's or Master's in electrical engineering, 8+ years in renewable power generation, PE license or eligible, experience with PVSyst/Helioscope/Homer/Xendee and AutoCAD, ability to perform power system calculations and lead design packages.
IPG PhotonicsNASDAQ: IPGP: Develops and manufactures high-performance fiber lasers and systems.
10+ YOEBSME/MSME preferred; 10+ years in mechanical design for laser/optical/medical devices; strong PM/leadership; SOLIDWORKS with PDM; packaging, opto-mechanical, electronics interface; MS Office;
SOLIDWORKS, SOLIDWORKS PDM, MS Office, Visio, Project
Miami or Boston or Greensboro or Charlotte or Wilmington or Atlanta or Houston or Washington or San Francisco
$80k-$133k/yrHybridFull Time
ArcadisEuronext Amsterdam: ARCAD: Designing and engineering sustainable solutions for natural and built environments
BS in mechanical or fire protection engineering; US Fire Protection PE licensure; experience in IFC design packages for federal facilities; knowledge of NFPA, NEC, NESC, UL; fire alarm and suppression systems expertise; strong communication skills.
Revit, BIM, Autodesk Construction Cloud, AutoCAD, HydraCAD, Navisworks
Integra LifeSciencesNASDAQ: IART: Manufacturing surgical instruments and regenerative medical technology devices.
8+ YOEBachelor's in engineering or science required; experience requirement varies by degree (BSc+8y, MSc+5y, PhD+3y). Subject-matter expertise in one or more validation areas (equipment, process, packaging, cleaning, utilities, temp mapping); cGMP/QSR/ISO knowledge and project management skills.
Experienced in designing access control, CCTV/IP, intrusion detection systems; performing site surveys; developing design packages and construction documentation; coordinating with architects/MEP/IT; familiarity with applicable codes and standards.
AMETEKNYSE: AME: Manufacturer of electronic instruments and electromechanical devices.
3+ YOEBachelor's in engineering or equivalent and 3+ years manufacturing/quality engineering experience; knowledge of ISO 9001:2015, contract review, traceability, OQE, and data package preparation.