30 packaging engineer jobs at 12 companies in Eloy, AZ
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yrOnsiteFull Time
SnapNYSE: SNAP: Develops social media applications and augmented reality technology.
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEMaster's in engineering/physics/chemistry with 1+ years (or PhD with 6+ months). Experience in packaging assembly, SPC, DOE, DFM, data analysis, and risk assessment required.
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
ArmNASDAQ: ARM: Designs and licenses processor architectures and semiconductor intellectual property.
5+ YOE5+ years power integrity experience, expertise in SIPI analysis, multi-port matrix parameters, electromagnetic extraction, ability to provide technical direction and supervise package builds; Linux and scripting experience preferred.
Microchip TechnologyNasdaq: MCHP: Manufacturer of microcontrollers, analog, and mixed-signal integrated circuits.
2+ YOEMinimum 2 years experience in physical failure analysis, expert with Dual Beam FIB/SEM, experience with package decapsulation, CNC milling, X-ray and C-SAM, bachelor’s or master’s in a technical field, strong technical writing and device knowledge.
Dual Beam FIB/SEM, FIB/SEM, SEM, TEM, CNC milling, X-ray analysis, C-SAM (Scanning Acoustic Microscopy)
Arizona Public ServiceNYSE: PNW: Provides electric utility services to customers throughout Arizona.
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
NXP SemiconductorsNASDAQ: NXPI: Designs and manufactures semiconductors for automotive and IoT applications.
15+ YOEBachelor's in engineering or related field; 15+ years in semiconductor R&D, technology or product development; demonstrated NPI leadership, process/package/IP expertise, and program management experience.
AdvantestTokyo Stock Exchange: 6857: Manufacturer of automated test systems for the semiconductor industry.
15+ YOE15+ years leadership in semiconductor/interconnect/advanced packaging; deep SI/PI and socket/interconnect design expertise; proven R&D-to-HVM scaling; executive global engineering leadership; DFA and factory automation experience.
Casa Grande or Tucson or Sioux City or Opelousas or Albuquerque or Santa Fe or Manlius or Spokane
$56k-$76k/yrOnsiteFull Time
Indian Health Service: Provides comprehensive health services to Native American communities.
1+ YOEExperience creating CAD drawing packages, performing surveying, and construction cost estimating; valid state driver's license; U.S. citizenship; successful background investigation; meet GS-8 specialized experience (1 year equivalent to GS-7).
Bechtel: Designs and constructs large-scale industrial and infrastructure projects.
5+ YOEDevelop and maintain Installation Work Packages (IWPs), manage constraints, support AWP/WFP processes, coordinate with engineering/procurement/construction, and analyze planning performance. Requires bachelor's + 5+ years experience or 9+ years without degree.