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93 packaging engineer jobs at 48 companies in Arizona

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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Develops social media applications and augmented reality technology.
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$135k-$203k/yr OnsiteFull Time
Snap
SnapNYSE: SNAP: Provides visual messaging software and augmented reality wearable devices.
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
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1mo
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Packaging Application Engineer - Folding Cartons
De Pere or Wisconsin or Arizona
OnsiteFull Time
Belmark
Belmark: Manufactures innovative labels, flexible packaging, and folding cartons.
3+ YOEB.S. in engineering/technology and ~3 years packaging/application engineering experience; strong material/process knowledge, data analysis, technical communication, and Microsoft Office proficiency.
Microsoft Word, PowerPoint, Microsoft Excel
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1w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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Packaging Module Development Engineer
Phoenix, Arizona, United States
$115k-$220k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's degree in Mechanical, Materials, Electrical Engineering, Physics/Applied Physics or related; 3+ years experience or PhD; programming (Python, MATLAB); AI/ML; semiconductor packaging experience; onsite presence.
Python, MATLAB, Artificial Intelligence, Machine Learning
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Packaging Sales Engineer
Washington or Oregon or California or Nevada or Utah or Arizona
FieldFull Time
ProMach
ProMach: Designs, manufactures, and integrates comprehensive packaging and processing solutions.
2+ YOE2–5 years in technical support or packaging machinery roles, understanding of packaging machine components, ability to read technical drawings, CAD experience (AutoCAD, SolidWorks) preferred, strong communication and customer service skills, comfortable with frequent travel (~50%).
Salesforce CRM, AutoCAD, SolidWorks
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1w
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Technical Packaging Manager
Waddell or South Carolina
$97k-$121k/yr OnsiteFull Time
Mark Anthony Group
Mark Anthony Group: Produces and distributes alcoholic beverages and ready-to-drink products.
5+ YOEBS degree, 5+ years packaging operations management in high-speed environments, IBD packaging certification, beverage packaging expertise, SPC, root cause analysis, Power BI, capital project and cross-functional leadership skills.
Power BI, SPC
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Sr Mechanical Engineer – Electronics Packaging
Tucson, Arizona, United States
$87k-$165k/yr OnsiteFull Time
RTX
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
5+ YOEBachelor's in STEM, 5+ years mechanical design, CAD/GD&T, electronics packaging, environmental/structural/thermal analysis, security clearance.
CAD, GD&T, Creo, Windchill
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3w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
Amazon
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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Principal Engineer, Electrical Engineering – Advanced Packaging
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
10+ YOEBachelor's degree in Electrical Engineering, 10+ years in semiconductor capital equipment, expertise in RF/motion/power/safety systems, knowledge of SEMI/CE/UL/EMC, experience with requirements management and FMEA, proven technical leadership.
PLC, DFMEA, FMEA
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
Cisco
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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2mo
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Principal Engineer
Scottsdale, Arizona, United States
OnsiteFull Time
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
Masters in Electrical Engineering with semiconductor device physics; TCAD and device simulation; 3D EM/analog RF tools; BJT/SCR/diode measurements; flip-chip/wire-bond packaging knowledge; strong communication and leadership.
TCAD, 3D EM simulation tools, Analog/RF circuit analysis tools, Device measurement tools
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
HCLTech
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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Principal Package Design Engineer
Tempe, Arizona, United States
HybridFull Time
Renesas Electronics
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years semiconductor package development experience with hermetic/ceramic/metal/radiation-tolerant/Class P plastic packages; AutoCAD and Microsoft Office proficiency; familiarity with MIL standards; strong communication and collaboration skills.
AutoCAD, Microsoft Excel, Microsoft PowerPoint, Microsoft Word
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3w
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Senior Mechanical Engineer
Goodyear, Arizona, United States
$100k-$130k/yr OnsiteFull Time
fairlife
fairlifeNYSE: KO: Produces nutrient-dense and ultra-filtered dairy products and shakes.
Bachelor's in Mechanical Engineering, experience in high-speed manufacturing/dairy processing and packaging, familiarity with CI/Lean/GMP/5S, ability to lift 50 lbs, lead capital projects, perform BDA/RCA, and maintain machine documentation.
D365
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
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4w
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Mechanical Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International
Marketech InternationalTaiwan Stock Exchange: 6196: Provides turnkey facility integration and engineering for semiconductor plants.
2+ YOE2+ years in mechanical engineering, permitting, construction coordination or related field; experience with mechanical drawings, permit packages, AHJ coordination, and familiarity with building/mechanical codes; strong organization and communication.
AutoCAD, Bluebeam, Revit
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2mo
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Field Applications Engineer III, IV, or V
Arizona, United States
OnsiteFull Time
Brewer Science
Brewer Science: A that develops high-technology solutions for semiconductor and microelectronics markets.
4+ YOEField Applications Engineer III/IV/V with engineering degree and 4+ years (III) or 6+ years (IV) or 8+ years (V) of experience; experience with Advanced Semiconductor Packaging preferred; willingness to travel to customer sites.
Spin coaters, Hot plates, Ellipsometers, Bonder/debonder, Laboratory equipment, Statistical tools
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Senior Mechanical Engineer (HVAC) (US)
Clay or Reston or Arizona or Ohio or Texas or India or United States
HybridFull Time
Bechtel
Bechtel: Designs and constructs large-scale industrial and infrastructure projects.
8+ YOEBachelor's in mechanical engineering plus 8+ years relevant HVAC/Dry systems experience; strong knowledge of cleanroom and HVAC standards, equipment packages, Revit/Navisworks/BIM experience, and ability to lead design and field investigations.
Revit, Navisworks, BIM, Bechtel Standard Application Programs (BSAPs)
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Senior Electrical Engineer 2 - Nuclear
Phoenix, Arizona, United States
$100k-$153k/yr HybridFull Time
Sargent & Lundy
Sargent & Lundy: Engineering and consulting services for the power industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Python, MATLAB, Microsoft Excel
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