65 packaging engineer jobs at 32 companies in Hutto, TX
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Packaging Engineer I
Austin, Texas, United States
OnsiteFull Time
2+ YOEBachelor's degree preferred, 2+ years packaging engineering experience, familiarity with ISTA/ASTM testing, packaging software (TOPS, MaxLoad Pro), PLM systems, and strong communication and project management skills.
TOPS, MaxLoad Pro, Product Lifecycle Management (PLM)
2w
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Principal Packaging Engineer
Santa Clara or Austin or Bangalore or Boston
$200k-$500k/yr OnsiteFull Time
Deep experience in advanced semiconductor package architecture, substrate/assembly technologies, package-level signal and power integrity, thermal and reliability considerations, and cross-functional system optimization.
2w
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Semiconductor Packaging Engineer
Austin, Texas, United States
$115k-$180k/yr OnsiteFull Time
5+ YOEMasters or equivalent experience in EE/Materials/Mechanical,5+ years semiconductor packaging experience,knowledge of materials,thermal management,reliability testing,strong analytical and troubleshooting skills.
3w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
1w
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Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)
Bastrop, Texas, United States
OnsiteFull Time
5+ YOEBachelor's in materials science or mechanical engineering,5+ years microelectronics device research or manufacturing,ability to work extended hours/weekends,ITAR-eligible (US work authorization),mentoring experience preferred.
MATLAB, JMP, MES, PFMEA, SPC, GD&T
3w
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Junior Software Packaging Engineer
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yr HybridFull Time
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
Java, Kotlin, C++, Golang, Postgres, AWS, Git, PowerShell, Zsh, CI/CD, Copilot, Claude
1w
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Principal Battery/High Voltage/High Power Packaging Engineer
Endicott or Austin or Detroit or New York or Texas or Michigan
$107k-$183k/yr OnsiteFull Time
8+ YOEBachelor’s in Mechanical Engineering,8+ years related experience,expertise in battery and high-voltage packaging,thermal/structural analysis,lightweight materials,manufacturing interface,and strong communication skills.
3D CAD
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Integrated Circuit Packaging Architect
Austin, Texas, United States
$142k-$244k/yr HybridFull Time
Proven semiconductor technology development experience, leadership driving engineering teams, expertise in materials/thin film/process/packaging, experience with manufacturing partners and yield improvement; BS/MS/PhD in relevant field.
4d
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Materials Engineer, Packaging Product Design
Austin, Texas, United States
OnsiteFull Time
Design and execute structural packaging for consumer products, ensure product protection and sustainability, and collaborate with cross-functional teams during design processes.
2mo
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Packaging Sourcing Specialist
Austin or Texas or United States
HybridFull Time
2+ YOEBachelor’s degree in SCM/Packaging/Engineering; 2+ years packaging/supply chain experience; knowledge of packaging materials; proficient in MS Office; travel up to 25%; fast-paced CPG experience preferred.
Microsoft Office, Excel, TOPS
1mo
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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Senior Director, Advanced Packaging Disruptive Technology
Santa Clara or Austin or Covington
$200k-$275k/yr OnsiteFull Time
15+ YOESenior technical leader with 15+ years in semiconductor packaging/panel processing; experience leading technology strategy, customer engagements, and cross‑functional teams; PhD/MS preferred.
Design of Experiment (DOE)
1w
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Package Design Methodology Engineer
Santa Clara or Austin or California
$136k-$265k/yr HybridFull Time
5+ YOEBS or equivalent and 5+ years developing package design flows; strong Python/C++ skills; experience applying AI/ML and LLMs in engineering workflows; solid VLSI package design fundamentals.
Python, C++, LLMs, EDA, AI/ML
1w
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Package Design Methodology Engineer
Santa Clara or Austin or United States
$136k-$265k/yr HybridFull Time
5+ YOEBS in CS/EE or equivalent,5+ years developing package design flows/methodologies,proficiency in Python and/or C++,knowledge of VLSI package electrical fundamentals,experience applying AI/ML or LLMs in engineering workflows.
Python, C++, LLMs, EDA
5d
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Mechanical Engineer II
Austin, Texas, United States
$120k/yr OnsiteFull Time
3+ YOEBachelors in mechanical engineering,3+ years product development experience,proficient in Onshape/SolidWorks/Creo,GD&T,prototyping,electronics packaging,thermal management,DFM/DFA,engineering documentation.
Onshape, SolidWorks, Creo, GD&T, FEA, PLM, PDM, ECO, ECN
1mo
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IWT Process Engineer
Austin, Texas, United States
$76k-$145k/yr OnsiteFull Time
2+ YOEB.S. in chemical or other engineering preferred; 2+ years engineering experience in water treatment; knowledge of water chemistry and unit processes; experience in industrial operations; ability to monitor, troubleshoot, and prepare work packages.
5d
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Staff Package Development Engineer
Austin, Texas, United States
HybridFull Time
5+ YOEBachelor's in relevant engineering, 5+ years semiconductor package development experience, knowledge of assembly processes, DOE/statistical analysis, reliability testing, and strong communication and project skills.
5d
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1mo
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Equipment Engineer, Texas Institute for Electronics
Austin or Austin
OnsiteFull Time
3+ YOEBachelor's in engineering, 3+ years semiconductor fab or advanced packaging equipment engineering, equipment installation project management, SPC experience, ability to work independently, strong communication; must be authorized to work in the US without sponsorship.
SPC, OEE, SEM, LinkedIn Learning, E-Verify
1mo
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Senior Structural Engineer
Austin, Texas, United States
$115k/yr OnsiteFull Time
8+ YOEBS in civil/structural engineering required (MS/PhD preferred), 8+ years structural experience (4+ years in nuclear or safety-critical preferred), PE (or pursuing) in a US jurisdiction, proficiency with major FEA packages, knowledge of relevant codes and DOE/NRC documentation.
ANSYS, ABAQUS, SAP2000, Jama Connect, Teamcenter
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