92 packaging engineer jobs at 47 companies in Manteca, CA
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Packaging Engineer
San Ramon, California, United States
$84k-$105k/yrHybridFull Time
Rodan + Fields: Develops and sells dermatology-inspired skincare and haircare products.
3+ YOEBachelor's in package or related engineering, 3+ years package development experience, strong technical drawing review, project management, analytical, leadership, and communication skills.
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOELead memory packaging development for 2.5D/3D and HBM/IPM solutions; supply chain and partner management; failure analysis and product integration to mass production.
Astera LabsNASDAQ: ALAB: Designs connectivity solutions for cloud and AI infrastructure.
10+ YOEPh.D. or M.S. in EE, Physics, Materials Science, Mechanical Engineering, or related field; 10+ years in photonic packaging or related areas; strong expertise in high-speed packaging, thermal management, and optomechanical design.
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
1+ YOEBachelor's degree in engineering/physics/materials, 1+ years semiconductor/packaging or photonics experience, hands-on optical alignment and fiber optics knowledge, data analysis (Excel/JMP/MATLAB/Python), SPC/DOE familiarity, strong problem-solving and collaboration skills.
Kevin's Natural Foods: Produces healthy, refrigerated and frozen ready-to-eat meals and sauces.
7+ YOEBachelor's in engineering, 7+ years packaging engineering experience in food/CPG, expertise in packaging materials/qualification, knowledge of FDA/USDA/SQF/HACCP/GMP, and ability to travel 20-30%.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
4+ YOEMS or PhD in engineering/physics,4+ years advanced packaging industry experience,expertise in heterogeneous integration,hybrid bonding and high-density interconnects,collaboration with foundries and OSATs.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
10+ YOEMaster's or PhD in engineering or related field, 8–10+ years packaging experience, expertise in SMT/PCBA/reliability, experience with die attach/wire bonding, ML/data analytics experience preferred.
Koch Inc.: Operates global manufacturing, refining, and industrial technology businesses.
10+ YOEPhD in a related field, 10+ years R&D experience in optoelectronic package design transferred to manufacturing, submicron optical alignment, FEA/thermal design, GR-468 qualification, NPI, and strong supplier/customer communication.
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
3+ YOEPhD in engineering discipline, 3+ years modeling/simulation experience in semiconductors, expertise in mechanical/thermal modeling, strong technical writing and collaboration skills.
Eurofins ScientificEuronext Paris: ERF: Global provider of analytical testing and laboratory services.
3+ YOEB.S. in engineering/packaging or HS/Associate plus 3-5 years packaging or production testing experience; proficiency with Microsoft Office; ability to lift 30 lbs; knowledge of ASTM standards desired.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
15+ YOE15+ years in semiconductor package development with expertise in Power SiP/modules, flip‑chip and wafer‑level packaging; experience leading R&D, NPI, OSAT qualification, SPC and statistical methods.
ASMLNASDAQ: ASML: Manufactures lithography systems used to print patterns on wafers.
6+ YOELead build/toolchain architecture for reproducible builds, hermetic environments, packaging, and developer productivity; 6+ years Linux distributed systems; bachelor’s in CS/engineering.
R&D Packaging Scientist 1 (Recent Grad Starting in 2026)
Pleasanton, California, United States
HybridFull Time
CloroxNew York Stock Exchange: CLX: Manufactures and markets consumer cleaning and wellness products.
Recent graduate (Dec 2025–Aug 2026) with a 3.0+ GPA in packaging, materials, or mechanical engineering; knowledge of ASTM testing; experience with ArtiosCAD and TOPS; able to work in a lab and prototype samples.
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.