65 packaging engineer jobs at 42 companies in Newton, MA
1mo
Save
Mark Applied
Hide
1mo
Packaging Engineer
Uxbridge, Massachusetts, United States
$68k-$78k/yrFieldContract, Full Time
Adept Group: Providing packaging engineering and consulting services to global brands.
1+ YOEBachelor's degree in packaging or related engineering field, 1–5 years relevant experience, proficiency with Microsoft Excel and PowerPoint, packaging testing and standards knowledge, and ability to lead audits and supervise field teams.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster's in engineering or related field required, 2 years packaging engineering experience, expertise with SolidWorks, ANSYS, and AutoCAD, IC package design and reliability, FMEA/PCN/SPC/DOE experience.
MannKindNASDAQ: MNKD: Develops inhaled therapeutic products for endocrine and lung diseases.
5+ YOEBS in Package Engineering with 7-10 years or MS with 5-7 years in pharmaceutical packaging; knowledge of cGMPs; packaging equipment and testing methods; strong organization and multitasking.
GPD Optoelectronics: Manufactures high-performance infrared photodetectors and custom optoelectronic sensors.
8+ YOEBS in engineering or materials, 8+ years semiconductor/photonics die packaging experience, expertise in packaging techniques, DOE and root-cause methods, ability to lead cross-functional teams.
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
5+ YOEBachelor's in Packaging, Mechanical, Biomedical Engineering or related field; 5–8 years packaging engineering in medical device/pharma; ISO 11607-1/2, ISO 13485, ISO 16975, ICH, ASTM/ISTA; DFSS, DOE; FEA; CAPE/TOPS/SolidWorks experience.
Tata Consultancy ServicesNational Stock Exchange of India: TCS: Global provider of IT services, consulting, and business solutions.
5+ YOEBachelor's degree, minimum 5 years medical device quality systems experience, knowledge of FDA/MDD/MDR GMP, PLM/ERP/SAP/Windchill experience, and experience leading cross-functional teams.
CorningNYSE: GLW: Develops and manufactures specialty glass, ceramics, and optical fiber.
1+ YOEBachelor's in Packaging Science + 3 years packaging engineering experience (medical/pharma/life sciences) or Master's + 1-2 years. Experience with DOE, ASTM/ISTA testing, TOPS Pro or CAPE, SolidWorks, interpreting drawings, and packaging for automation. Up to 25% travel.
TOPS Pro, CAPE, SolidWorks, Design of Experiments (DOE), ASTM, ISTA
Draper: Designs and develops advanced guidance and navigation technologies.
5+ YOE5+ years in electrical engineering or related field; expertise in IC package architecture, high-speed layout, SI/PI analysis; proficiency with Siemens Xpedition and industry SI tools; BS in EE required (MS preferred).
Johnson & JohnsonNYSE: JNJ: Global healthcare providing pharmaceuticals and medical technologies.
8+ YOE8+ years packaging or related supply chain experience in regulated industries, packaging engineering and supplier management experience, knowledge of sterile packaging and validation, ISO standards familiarity, strong financial and leadership skills.
Ringaskiddy or Zuchwil or Raynham or Raritan or Palm Beach Gardens or Warsaw
OnsiteFull Time
Johnson & JohnsonNYSE: JNJ: Provides pharmaceutical products and medical technology healthcare solutions.
8+ YOE8+ years packaging/engineering experience in regulated industry preferred; people management and project leadership; knowledge of sterile packaging, validations, ISO13485/11607, ISTA/ASTM; strong financial acumen and Microsoft Office proficiency.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEBachelor's or equivalent, 4+ years Linux system-level software development, experience with package management, repository and release automation, Python or Bash scripting, CI/CD and kernel/driver familiarity.
Chicago or Londonderry or Buffalo or Nampa or Tulare
OnsiteFull Time
Lactalis Heritage Dairy: Manufacturing and distributing global and local dairy food brands.
5+ YOEBachelor's in mechanical or chemical engineering,5+ years managing capital projects in food manufacturing,3+ years USDA/FDA plant experience,advanced Excel and AutoCAD skills,strong communication and continuous improvement mindset.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
TextronNYSE: TXT: Manufactures aircraft, defense systems, and industrial specialized vehicles.
10+ YOEBachelor's in Mechanical Engineering with 10+ years experience; 2+ years in project engineering; aerostructure/electronics packaging; cost-account management; active Secret clearance preferred; strong leadership and communication.
Lightmatter: Develops photonic processors and interconnects for AI data centers
5+ YOESenior thermal engineer with MS/PhD in engineering and 5+ years in package/system thermal analysis; expertise in conduction, convection, CFD; experience with advanced cooling tech; proficient in ANSYS tools; lab validation.
Arlington or Boston or Austin or Nashville or Bellevue or Arlington or New York or San Francisco or Irving or Houston
HybridFull Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
4+ YOEBachelor's in industrial/manufacturing engineering; 4+ years in industrial/operations engineering; experience with material handling equipment; knowledge of automated material handling systems, packaging and storage; intermediate AutoCAD, VBA, SQL.
AutoCAD, VBA, SQL, Microsoft Office, Visio, MS Project