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31 packaging engineer jobs at 14 companies in Vancouver, WA

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Packaging Module Development Engineer
Hillsboro, Oregon, United States
$115k-$220k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEBachelor's degree with 4+ years, master's with 3+ years, or Ph.D. in a relevant field; 4+ years in packaging module development, process characterization, or equipment optimization.
Design of Experiments (DOE)
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1w
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Technical Marketing Engineer Advanced IC Packaging
Wilsonville, Oregon, United States
$130k-$233k/yr HybridFull Time
Siemens
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
5+ YOE5+ years in 2.5D/3DIC or advanced IC packaging from an EDA perspective; EE/electronics academic background; scripting with Tcl and Python; Linux and Microsoft Office proficiency; customer-facing solution experience.
Tcl, Python, Linux, Microsoft Office
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1mo
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Circularity Innovation Engineer
Vancouver or Spring
$116k-$182k/yr OnsiteFull Time
HP
HPNYSE: HPQ: Manufactures personal computers, printers, and 3D printing hardware.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, experience with global supply chains, cross-functional leadership, and expertise in recycled/renewable materials and packaging transformation.
Workday
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
HCLTech
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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Circularity Innovation Engineer
Vancouver or Spring
$116k-$182k/yr OnsiteFull Time
HP
HPNYSE: HPQ: Manufacturer of personal computers, printers, and imaging devices.
8+ YOEBachelor's in engineering, 8–12+ years experience in circular economy, packaging or materials engineering, experience across global supply chains, strong cross-functional collaboration and problem-solving skills.
FDL, Panda, Viking, SIRA, Marble, EU CSRD, ESRS, LCA
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Principal Product Engineer
Mountain View or Austin or Redmond or Hillsboro
$143k-$275k/yr HybridFull Time
Microsoft
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEExperience in semiconductor IC development, manufacturing, testing and packaging; doctorate/masters/bachelor degree with corresponding years of engineering experience; security screening and export-control eligibility required.
ATE, Advantest V93K, RVP
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Circularity Innovation Engineer
Vancouver or Spring
$116k-$182k/yr OnsiteFull Time
HP
HPNYSE: HPQ: Produces personal computers, printers, and related digital imaging products.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, expertise in recycled/renewable materials, global supply chain experience, strong cross-functional and problem-solving skills.
Workday
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2w
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Mechanical Product Design Engineer II
Portland, Oregon, United States
$86k-$110k/yr HybridFull Time
Daimler Truck North America
Daimler Truck North AmericaXetra: DTG: Designs and manufactures commercial trucks and school buses.
2+ YOEBachelor's in engineering and 2+ years related experience; proficiency with CAD (preferably NX), Microsoft Office, strong communication, and ability to support vocational chassis packaging.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, Power Bi, VBA, Imacs, Smaragd, ERSE
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Field Applications Engineer
Hillsboro, Oregon, United States
$83k-$141k/yr OnsiteFull Time
KLA
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
0+ YOEMaster's degree (0 years) or Bachelor's plus 2 years; experience with metrology, testing techniques (spectroscopy, HPLC), wet etch and packaging applications; strong problem solving, technical writing, project coordination, and training skills; ~30% travel.
Microsoft Outlook, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Project, spectroscopy, HPLC
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6d
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Field Applications Engineer - Power Delivery
California or Vancouver or Chandler or San Jose
$150k-$225k/yr HybridFull Time
PowerLattice
PowerLattice: Develops power delivery chiplets for high-performance AI processors.
5+ YOERequires 5 years in power or signal integrity for high-performance SoCs, package-level expertise, debugging skills, customer communication, discretion, and independent problem-solving.
GPU, CPU, SoC, PDN, CoWoS
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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr HybridFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
12+ YOEBS, MS, or PhD in electrical engineering, physics, or computer engineering; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional system-manufacturing design.
AI
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2mo
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MEP Cost Control Engineer
Lake Oswego or Beaverton or Gresham or Hillsboro or Portland or McMinnville or Oregon
$90k-$120k/yr OnsiteFull Time
Hoffman Construction Company
Hoffman Construction Company: General contractor specializing in large-scale and complex construction projects.
2+ YOEAnalyze MEP cost proposals, prepare cost estimates and authorization packages, maintain job cost reports and forecasts, perform on-screen material takeoffs; 2+ years construction estimating experience and bachelor's in engineering or construction management required.
Microsoft Windows, Microsoft Excel, Microsoft Word, Microsoft Outlook, Microsoft PowerPoint, Microsoft Teams, Prolog, Procore, E-Builder, Bluebeam, Microsoft Project, Primavera P6, AutoCAD, Revit, Navisworks
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Field Support Engineer 3
Vancouver or Portland
$60k-$65k/yr OnsiteFull Time
Tech Mahindra
Tech MahindraNational Stock Exchange of India: TECHM: Global provider of information technology and business process services.
7+ YOEBachelor's degree,7+ years IT experience with Windows desktop/laptop imaging, OS deployment, device provisioning, application packaging, troubleshooting, and strong communication.
Windows
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2w
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Staff Manufacturing Engineer, Advanced Components (62390)
Lake Oswego, Oregon, United States
OnsiteFull Time
BIOTRONIK
BIOTRONIK: Manufactures cardiovascular and endovascular medical devices for patient therapy.
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint
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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr OnsiteFull Time
NVIDIA
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOEBS, MS, or PhD in EE, Physics, or CE; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional semiconductor development.
AI
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1d
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Service Sales Manager – Processing & Packaging Equipment
Portland or Raleigh or North America
$95k-$125k/yr FieldFull Time
Syntegon
Syntegon: Produces process and packaging technology for pharma and food industries.
2+ YOEBachelor's degree in engineering, science, or business, or equivalent experience. Requires 2+ years in capital equipment sales, territory management, customer relations, field service, technical support, or project management.
CRM
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2mo
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Key Account Technologist 5
Tualatin, Oregon, United States
HybridFull Time
Lam Research
Lam ResearchNASDAQ: LRCX: Designs and manufactures wafer fabrication equipment for the semiconductor industry.
5+ YOEM.S. (8+ yrs) or Ph.D. (5+ yrs) in Materials Science/Chemical Engineering/Chemistry/Physics or equivalent; experience in etch/deposition/packaging, SPC/DOE, JMP/Minitab; customer-facing travel and leadership skills.
JMP, Minitab
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