75 packaging engineer jobs at 34 companies in Washington
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Packaging Engineer (Bothell, WA)
Bothell, Washington, United States
$103k-$177k/yrHybridFull Time
PhilipsEuronext Amsterdam: PHIA: Manufactures medical imaging systems and personal care appliances.
3+ YOE3+ years designing paperboard, corrugate, thermoformed and pulp tray packaging; Bachelor’s in Engineering or equivalent; experience with ArtiosCAD, CAPE Pack, Adobe Illustrator, Solidworks/CREO; knowledge of packaging testing, sustainability, and logistics.
Pacific Northwest Defense Coalition: Trade association for the Northwest defense and security industry.
1+ YOEBachelor's degree or equivalent experience in engineering or related field, 1+ years relevant semiconductor/packaging experience preferred, hands-on packaging and assembly experience, DOE experience, ability to lift 50 lbs, pass background check.
Helion: Building fusion reactors to produce clean, low-cost electricity.
Hands-on experience in power electronics packaging for high-current/high-voltage applications, strong thermal engineering and modeling skills, experience with SCRs/diodes, and proven ability to translate research into hardware.
Washington or Oregon or California or Nevada or Utah or Arizona
FieldFull Time
ProMach: Designs, manufactures, and integrates comprehensive packaging and processing solutions.
2+ YOE2–5 years in technical support or packaging machinery roles, understanding of packaging machine components, ability to read technical drawings, CAD experience (AutoCAD, SolidWorks) preferred, strong communication and customer service skills, comfortable with frequent travel (~50%).
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yrHybridFull Time
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
Blue Origin: Develops reusable rockets and systems for human spaceflight.
12+ YOELead IC packaging team; manage end-to-end package development for RF/mmWave AiP and complex SoCs; perform EM, SI, and thermal simulations; collaborate with IC designers and OSATs.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
3+ YOE3+ years mechanical engineering experience, Bachelor's in mechanical engineering required, CAD experience, electronics packaging and avionics or aerospace experience preferred, U.S. work-authorization/citizenship required, strong problem-solving and communication.
HPNYSE: HPQ: Manufactures personal computers, printers, and 3D printing hardware.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, experience with global supply chains, cross-functional leadership, and expertise in recycled/renewable materials and packaging transformation.
San Diego or District of Columbia or Jacksonville or Honolulu or Pearl Harbor or Norfolk County or Silverdale
$106k-$158k/yrOnsiteFull Time
Department of the Navy: Operates and maintains combat-ready naval and marine forces.
1+ YOELead and review facilities mechanical engineering design packages, provide SME recommendations on design submittals, and consult on mechanical design during construction; professional engineering degree or EI/EIT/PE or FE acceptable.
Pearce ServicesNYSE: CBRE: Provides technical services for telecom and energy infrastructure.
Lead end-to-end OSP engineering for fiber and copper builds, ensure NESC and client standards compliance, perform field surveys and QA/QC, produce engineering plans and permit packages, and mentor junior staff.
HPNYSE: HPQ: Manufacturer of personal computers, printers, and imaging devices.
8+ YOEBachelor's in engineering, 8–12+ years experience in circular economy, packaging or materials engineering, experience across global supply chains, strong cross-functional collaboration and problem-solving skills.
FDL, Panda, Viking, SIRA, Marble, EU CSRD, ESRS, LCA
HPNYSE: HPQ: Produces personal computers, printers, and related digital imaging products.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, expertise in recycled/renewable materials, global supply chain experience, strong cross-functional and problem-solving skills.
Schweitzer Engineering Laboratories: Manufactures digital systems that protect and automate power grids.
6+ YOEBS in Mechanical Engineering or related field; 6+ years in electromechanical packaging, CAD (SolidWorks), heat transfer; strong simulation and project management; strong writing and communication.
Crane CompanyNYSE: CR: Manufactures engineered components for aerospace and industrial process markets.
8+ YOEBA/BS in engineering required (Master's/PhD preferred), 8+ years relevant experience, knowledge of mechanics, heat transfer, vibration, and electronics packaging, proficiency with Autodesk Inventor, mentoring experience, and ability to perform analyses and testing.
Gravitics: Designs and manufactures large-scale orbital space structures.
5+ YOEBachelor’s in Electrical Engineering; 5+ years in power converter or electrical power system development; design/testing 1-10 kW power systems; space-environment packaging; strong collaboration skills.