Nutrabolt: Produces performance sports nutrition products and energy drinks.
2+ YOEBachelor’s degree in SCM/Packaging/Engineering; 2+ years packaging/supply chain experience; knowledge of packaging materials; proficient in MS Office; travel up to 25%; fast-paced CPG experience preferred.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Proven semiconductor technology development experience, leadership driving engineering teams, expertise in materials/thin film/process/packaging, experience with manufacturing partners and yield improvement; BS/MS/PhD in relevant field.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
10+ YOEBS with 10+ years of relevant experience; strong FEM experience (ANSYS/ABAQUS); MATLAB and/or Python; Gen-AI/ML; knowledge of packaging materials and electronic packaging.
ANSYS, ABAQUS, HyperMesh, MATLAB, Python, Generative AI tools
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yrHybridFull Time
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
The Goodkind Co: Contract manufacturer of clean and natural personal care products.
High school diploma required. Perform filling, labeling, batching, cleaning, and packaging; follow SOPs and GMP; must be organized, dexterous, and able to stand for long periods.
Dell TechnologiesNYSE: DELL: Provides information technology hardware, software, and services.
3+ YOE3+ years professional design experience in packaging/visual design, strong packaging portfolio, proficiency with Adobe tools and 3D rendering software, and experience using AI-assisted creative tools.
Adobe Illustrator, Adobe Photoshop, Adobe InDesign, Adobe After Effects, Adobe Premiere, KeyShot, Blender, Cinema 4D, Maya, Electronic Medical Records (EMR)
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
5+ YOE5+ years professional experience with packaging and brand systems; strong portfolio in food/CPG preferred; experience with data-driven improvements, cross-functional collaboration, art directing photography, and Adobe design tools.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
15+ YOESenior technical leader with 15+ years in semiconductor packaging/panel processing; experience leading technology strategy, customer engagements, and cross‑functional teams; PhD/MS preferred.
Director, Advanced Packaging Disruptive Technology (Based in Singapore)
Santa Clara or Boise or Rehovot or Austin or Heimstetten or Singapore
OnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
15+ YOE15+ years in semiconductor technology with advanced packaging expertise (D2W, RDL, CoWoS, TSV), demonstrated innovation leadership, experience building and leading R&D teams, ability to translate technology to business strategy; willing to relocate to Singapore.
8+ YOEBachelor’s in Mechanical Engineering,8+ years related experience,expertise in battery and high-voltage packaging,thermal/structural analysis,lightweight materials,manufacturing interface,and strong communication skills.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
4+ YOE4+ years package CAD/layout or substrate design experience (6+ preferred); strong background in FCBGA, SiP, WLCSP, power modules; proficiency with Cadence Allegro Package Designer or Siemens Xpedition; BS/MS in EE, microelectronics, materials, or related field.
Sr. IC Package Design Engineer (Silicon Engineering)
Austin or Irvine
OnsiteFull Time
SpaceX: Designs and launches advanced rockets and satellite internet constellations.
5+ YOEBachelor's degree in electrical/computer engineering or physics; 5+ years IC package design experience; strong SI/PI, RF, and CAD tool proficiency.