711 packaging jobs at 247 companies in Oakland, CA
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Packaging Engineer
San Ramon, California, United States
$84k-$105k/yrHybridFull Time
Rodan + Fields: Develops and sells dermatology-inspired skincare and haircare products.
3+ YOEBachelor's in package or related engineering, 3+ years package development experience, strong technical drawing review, project management, analytical, leadership, and communication skills.
ASR Group: Global refiner and marketer of cane sugar products.
2+ YOEProvide mechanical and electrical maintenance for packaging and palletizing equipment, perform troubleshooting, welding/fabrication, preventative maintenance, and follow safety and GMP practices.
Ability to weigh, measure, label, and package products accurately, maintain sanitation, lift up to ~30 lbs, complete background check, must be 21+, high school diploma preferred.
Gilead SciencesNASDAQ: GILD: Develops and sells medicines for life-threatening infectious diseases.
4+ YOE4+ years packaging engineering experience in cGMP pharmaceutical/biotech preferred; Bachelor's in engineering (or Master's with 2+ years); knowledge of packaging development, qualification, and regulatory documentation.
ExelixisNASDAQ: EXEL: Discovers and commercializes innovative medicines for cancer treatment.
1+ YOEBachelor's or equivalent plus packaging operations experience; experience supporting CMOs, serialization, review/approval of packaging records, MS Office proficiency, strong analytical and communication skills.
Velaura AI: Developing ultra-low-power silicon and IP for AI accelerators.
Deep experience in advanced semiconductor package architecture, substrate/assembly technologies, package-level signal and power integrity, thermal and reliability considerations, and cross-functional system optimization.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Imperative Care: Develops medical devices for stroke and vascular disease treatment.
5+ YOEBachelor's degree or equivalent with 5+ years medical device packaging experience; sterile barrier system and packaging validation (ISO 11607) experience; SolidWorks and statistical tools (Minitab or JMP); supplier drawing and process qualification experience.
DensityAI: Designing custom AI hardware accelerators for large language models.
10+ YOE10+ years in advanced multi-die packaging (SiP, CoWoS, EMIB, interposers); expertise in design layout, SI/PI, thermo-mechanical tradeoffs; hands-on with packaging flows for 2.5D/3D; ability to collaborate with architects; DFT/RTL/PD optional.
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
Palo Alto or Los Angeles or Boston or Chicago or Sydney
$200k-$260k/yrOnsiteFull Time
Diraq: Builds scalable quantum processors using silicon CMOS technology.
Bachelor's in engineering or materials science, significant semiconductor packaging experience, expertise in PCB/substrate and mechanical design, failure analysis, thermal management, and delivering scalable hardware from concept to manufacturing.
Delos Data: Building specialized interconnects and infrastructure optimized for AI inference.
B.S./M.S. in EE or related, expertise in multi-die package design and UCIe, substrate and SI/PI knowledge, experience with TSMC/OSAT and managing subcontractors; HFSS/Sigrity familiarity a plus.
Kendo BrandsEuronext Paris: MC: Incubates and develops global prestige beauty and skincare brands.
5+ YOE5+ years design experience (1+ year packaging), BA in design preferred, Adobe CC proficiency (Illustrator, Photoshop, InDesign), strong communication, organization, and ability to meet tight deadlines.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
10+ YOEMaster's or PhD in engineering or related field, 8–10+ years packaging experience, expertise in SMT/PCBA/reliability, experience with die attach/wire bonding, ML/data analytics experience preferred.
Cspeed IO: A stealth startup developing next-generation optical semiconductor solutions for AI infrastructure.
6+ YOEMS/PhD in mechanical engineering/materials science or equivalent; 6+ years FEA for semiconductor packaging; expert in one FEA/CFD tool and working proficiency in a second; experience correlating simulation to hardware.
Eurofins ScientificEuronext Paris: ERF: Global provider of analytical testing and laboratory services.
3+ YOEB.S. in engineering/packaging or HS/Associate plus 3-5 years packaging or production testing experience; proficiency with Microsoft Office; ability to lift 30 lbs; knowledge of ASTM standards desired.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint
CloroxNew York Stock Exchange: CLX: Manufactures and markets consumer cleaning and wellness products.
Operate and change over packaging equipment, perform quality checks and preventive maintenance, material handling, and follow safety and regulatory training.