Velaura AI: Developing ultra-low-power silicon and IP for AI accelerators.
Deep experience in advanced semiconductor package architecture, substrate/assembly technologies, package-level signal and power integrity, thermal and reliability considerations, and cross-functional system optimization.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Experience in packaging engineering including supplier management, test plan development and lab testing, Design for Transportability (DFT), packaging standards, continuous improvement, and ability to lead projects.
Imperative Care: Develops medical devices for stroke and vascular disease treatment.
5+ YOEBachelor's degree or equivalent with 5+ years medical device packaging experience; sterile barrier system and packaging validation (ISO 11607) experience; SolidWorks and statistical tools (Minitab or JMP); supplier drawing and process qualification experience.
NextrackerNASDAQ: NXT: Designs and manufactures solar tracking systems for utility-scale power plants.
8+ YOEBachelor's in Packaging/Mechanical/Industrial Engineering or related; 8–12+ years in industrial packaging; experience with returnable packaging, data analysis, CAD; Power BI proficiency; cross-functional collaboration; travel willingness.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Packaging engineering experience with supplier management, test plan development, Design For Transportability (DFT), standards development, continuous improvement, and ability to train others; travel ~10%.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced package engineer with CAD/simulation tool proficiency, package/PCB layout and power integrity expertise, scripting ability, and engineering degree.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
10+ YOEMaster's or PhD in engineering or related field, 8–10+ years packaging experience, expertise in SMT/PCBA/reliability, experience with die attach/wire bonding, ML/data analytics experience preferred.
Eurofins ScientificEuronext Paris: ERF: Global provider of analytical testing and laboratory services.
3+ YOEB.S. in engineering/packaging or HS/Associate plus 3-5 years packaging or production testing experience; proficiency with Microsoft Office; ability to lift 30 lbs; knowledge of ASTM standards desired.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint
KagomeTokyo Stock Exchange: 2811: Manufacturer of tomato-based foods, sauces, and culinary ingredients.
Performs pouch and case inspections, monitors packaging equipment, replenishes consumables, applies labels, follows GMP and food safety procedures; ability to stand long periods and lift 40+ lbs; high school preferred; production experience preferred.
label machines, thermometers, packaging machines, communication radios
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
15+ YOEBS in engineering required; MS/PhD preferred. 15+ years in optical/optoelectronic or advanced microelectronics development with materials and packaging architecture expertise; technical leadership and R&D experience.
San Diego or Vista or Santa Clara or Colorado Springs
$159k-$250k/yrOnsiteFull Time
Samtec: Manufactures electronic connectors, cables, and optical interconnect solutions.
15+ YOE15+ years in optical/optoelectronic or advanced microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, technology maturation, and technical leadership.
San Diego or Vista or Santa Clara or Colorado Springs
$187k-$212k/yrOnsiteFull Time
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
15+ YOESenior individual contributor with 15+ years in optical/optoelectronic or microelectronics development; BS in engineering required (MS/PhD preferred); expertise in materials, packaging architectures, process development, characterization, and technical leadership.
Axiado: Creates AI-driven security processors for data center infrastructure.
10+ YOESenior IC Packaging Engineer with 10+ years in IC packaging, expertise in FC BGA, SiP, RDL, and chiplet architectures, and leadership in packaging programs.
Joseph Gallo Farms: Produces all-natural cheeses and sustainable dairy products.
5+ MgmtAssociate degree required, 5+ years supervisory experience in food manufacturing, knowledge of packaging equipment, safety/GMP background, computer proficiency, English required, Spanish preferred, willing to work non-traditional hours.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.