2,167 physical design jobs at 754 companies in United States
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Senior Design Lead - Physical Design (96945)
United States
OnsiteFull Time
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
Advanced proficiency in physical design tools and methodologies, strong UX knowledge, leadership experience overseeing multiple design teams, stakeholder communication, and research on industry trends; CPD/CUXP certifications are valuable.
DensityAI: Designing custom AI hardware accelerators for large language models.
8+ YOE8+ years in physical design for high-performance chips at advanced nodes, expert across full physical design flow, hands-on with industry PD and signoff tools, and ability to collaborate with architects, RTL designers, EDA vendors, and foundries.
Cadence Innovus, Synopsys Fusion Compiler, PrimeTime, Tempus
Principal Physical Design Engineer , Data Center Engineering
Seattle, Washington, United States
$163k-$220k/yrOnsiteFull Time, Part Time
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
10+ YOEBachelor's in architecture/construction/engineering, 10+ years in mission-critical facilities, experience in concept design, permitting, construction execution, building systems integration; RA or PE preferred.
Cerebras SystemsNasdaq: CBRS: Manufactures specialized computer chips designed for AI.
10+ YOE10+ years physical design experience; expertise in full-chip physical verification, DRC/LVS resolution with ICV or Calibre, IR/EM analysis, 3D/2.5D packaging and die stacking; scripting with Tcl and Python; familiarity with Synopsys tools.
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
BS/MS/PhD in EE/ECE/CE/CS with experience in synthesis, PnR, timing closure; proficient with FusionCompiler, PrimeTime, RedHawk; scripting Tcl, Perl, Python; knowledge of low-power design; drive physical design from architecture to signoff.
KiwiCo: Sells educational subscription boxes and hands-on projects for children.
10+ YOE10+ years designing and shipping physical consumer products; deep 3D CAD and manufacturing expertise; experience with injection-molded plastics, mechanisms, prototyping, and supplier/manufacturer partnerships; design leadership experience.
SolidWorks, Fusion 360, Creo, 3D printing, laser cutting
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
0+ YOEDesign and implement physical IC/SoC from RTL to GDS, perform synthesis/place-and-route/CTS/STA, power and noise analysis, verification and optimization using EDA tools.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
3+ YOEBSEE/MSEE or equivalent; 3+ years in VLSI physical design on 5nm-3nm; strong P&R, timing, IR drop; scripting in Python/Perl/Tcl; experience with Synopsys and Cadence tools.
SK hynix Memory Solutions AmericaKorea Exchange: 000660: Develops semiconductor controllers and firmware for enterprise data storage.
Currently pursuing a BS/MS in EE/CE or related field; foundational VLSI and ASIC physical design knowledge; scripting experience (Python, Perl, TCL); familiarity with ASIC flow and strong analytical/problem-solving skills.
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
15+ YOE4+ MgmtMaster's in EE/CE plus 15+ years physical design experience, 4+ years technical lead experience, hands-on tapeout ownership, expertise with Synopsys/Cadence toolchains, STA, power/EMIR, UPF/CPF, Tcl/Python scripting, and ML/AI-driven physical-design workflows.
MetaNASDAQ: META: Develops social networking platforms and virtual reality technologies.
8+ YOEBachelor's in CS/CE or equivalent, 8+ years physical design implementation for digital SoCs, experience with advanced nodes (3nm or below), EDA tools, timing/power/physical verification, and methodology development.
Hewlett Packard EnterpriseNYSE: HPE: Provides global edge-to-cloud technology solutions and IT infrastructure services.
7+ YOEBS/MS in EE/CompEng, 7+ years ASIC physical design experience, strong expertise with Cadence Innovus and Synopsys Fusion Compiler, scripting in Tcl/Python/Linux shell, and physical signoff knowledge.
Hewlett Packard EnterpriseNYSE: HPE: Providing global edge-to-cloud infrastructure and IT solutions for businesses.
7+ YOEBS/MS in EE/CE or related, 7+ years ASIC physical design/methodology experience, expertise with Cadence Innovus and/or Synopsys Fusion Compiler, strong scripting (Tcl, Python, Linux shell), and physical signoff knowledge.
Singapore or Austin or Hsinchu or Shanghai or Shenzhen
OnsiteFull Time
AmbiqNYSE: AMBQ: Develops energy-efficient semiconductors for edge AI devices.
8+ YOEMaster's or Bachelor's in EE/CE, 8+ years IC physical design experience, expertise in floorplanning/placement/CTS/routing/physical verification, hands-on with Cadence Innovus and/or Synopsys Fusion Compiler, TCL scripting, English and Mandarin required.