763 process integration engineer jobs at 391 companies in United States
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Process Integration Engineer
Austin, Texas, United States
$92k-$206k/yrOnsiteFull Time
Samsung ElectronicsKorea Exchange: 005930: Develops and manufactures consumer electronics, semiconductors, and mobile devices.
5+ YOEBachelor's degree in physics, electrical engineering, or STEM; 5+ years in semiconductor yield or process integration; experience with LSI manufacturing; 28nm node knowledge; on-site role.
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
3+ YOE3+ years semiconductor process integration experience; MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field; experience in process integration, advanced packaging, or related semiconductor tech in an R&D environment.
DoE, data analysis, wirebond, microbump, hybrid bonding, 2.5D/3DIC packaging
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Ph.D. (or M.S. with relevant industry experience); strong semiconductor process integration experience in fab/foundry; knowledge of lithography, etch, deposition, metallization, implant, CMP; yield analysis, metrology, SPC; experience with Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, ANSYS.
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
MS or PhD in Electrical Engineering, Physics, Chemistry, Chemical Engineering, Materials Engineering, or related technical field. Experience with semiconductor process technology and wafer fabrication. Understanding of semiconductor device physics (CMOS, DMOS, Bipolar, Trench FET). DOE/data analytics experience; strong communication and collaborati...
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEMS or PhD in engineering plus 5+ years semiconductor experience; expertise in DRAM/NAND, process integration, device physics, materials science, experiment design, data analysis, and project leadership.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
5+ YOEProcess, module and device integration experience; data analysis, hardware characterization, documentation; cross-functional collaboration with vendors and customers.
Data Analysis, Hardware Characterization, Documentation, CMOS modules
Xanadu: Develops fault-tolerant quantum computers and open-source software using photonics.
5+ YOEMS or PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering; 5+ years foundry/photonic manufacturing; expertise in lithography, process integration, metrology, and tapeout.
Tower SemiconductorNASDAQ: TSEM: Global manufacturer of specialty analog integrated circuits.
7+ YOEMS/PhD in engineering, physics, or materials science; 7+ years in semiconductor process integration; experience with SPC, DOE, yield and failure analysis; strong communication and presentation skills.
E-test, Statistical Process Control (SPC), Design of Experiments (DOE), yield analysis tools
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEDegree in engineering, materials science, physics or related plus relevant process integration/yield experience; proficiency with data analysis using SQL and Python; strong communication and mentoring skills.
Fort Worth or Marietta or Palmdale or California or Massachusetts or New York or Colorado or Hawaii or Illinois or Maryland or Minnesota or New Jersey or Vermont or Washington or District of Columbia
$123k-$245k/yrRemoteFull Time
Lockheed MartinNYSE: LMT: Designs and manufactures global security and aerospace systems.
U.S. citizen able to obtain Secret clearance; experience with aircraft engineering drawing release/change processes (BTP), Product Lifecycle Management tools; strong communication, process integration, and stakeholder collaboration skills; Siemens Xcelerator preferred.
Western DigitalNASDAQ: WDC: Design and manufacture data storage devices and systems.
MS/PhD in engineering or physics, semiconductor wafer process experience, proficiency with JMP and SQL/Python, project leadership and strong communication skills.
Microchip TechnologyNasdaq: MCHP: Manufacturer of microcontrollers, analog, and mixed-signal integrated circuits.
12+ YOEBachelor's in Electrical Engineering or related, 12+ years semiconductor process integration experience, knowledge of CMOS process integration and device physics, TCAD/PDK familiarity, strong analytical and communication skills.
FormFactorNASDAQ: FORM: Manufacturer of semiconductor test and measurement equipment.
5+ YOEExperienced engineer for assembly and test process development for probe card architectures; strong DOE/SPC skills, failure analysis, metrology, and cross-functional collaboration. Advanced degree or equivalent experience required.
ATE Testing, DOE, SPC, Precision Metrology, Electrical Testing, Failure Analysis, Statistical Data Analysis
HRL Laboratories: Conducts advanced scientific research for aerospace and automotive industries.
5+ YOEPh.D. or Master’s in physical science/engineering with 5+ years R&D fabrication experience; process development, DOE, statistical analysis, fabrication techniques (photolithography, DRIE, CVD), metrology, and strong communication skills.
L-Edit, Cadence, JMP, MATLAB, Python, COMSOL, SolidWorks, SEM
6+ YOELead process integration for superconducting IC fabrication; collaborate with foundries; strong semiconductor process knowledge; LSI/semiconductor R&D experience preferred; authorized to work in the U.S.
statistical methods, design of experiments, process optimization, documentation
LumentumNASDAQ: LITE: Manufacturer of optical and photonic components for global networks.
3+ YOEProcess integration engineer for III-V wafer devices; PhD (3+ years) or MS (5+ years) in physics, EE, or materials; hands-on optics; VBA/LabVIEW/C/C++, Matlab; MES/QMS/DOE/统计分析; on-site in San Jose, CA.
ImpinjNASDAQ: PI: Provides RAIN RFID technology for tracking and identifying items.
5+ YOEBachelor's in engineering/physics, 5+ years semiconductor process experience including backend/WLCSP/packaging, failure analysis using SEM/TEM/FIB/ion milling/AFM, DOE/SPC/yield analysis, JMP/Minitab/Python/MATLAB, Lean Six Sigma/8D, occasional international travel.
SEM, TEM, FIB, ion milling, AFM, JMP, Minitab, Python, MATLAB
MACOMNASDAQ: MTSI: Designs and manufactures semiconductor products for communications infrastructure.
3+ YOEMS or PhD in Electrical Engineering, Materials Engineering, Physics, or similar; minimum 3 years semiconductor fab experience; U.S. Person per ITAR.
Geo Owl: Provides geospatial intelligence and remote sensing for defense missions.
10+ YOEBachelor's in CS/IS/Engineering, 10+ years in AI/ML deployment or systems integration, 5+ years supporting IC/DoD/federal analytic environments, expertise in prompt engineering, BPMN, Lean Six Sigma, Agile, and active TS/SCI with CI polygraph.